Pixelworks, Inc., a leading provider of visual processing solutions, announced that the newly launched realme P4 5G and P4 Pro 5G smartphones incorporate Pixelworks' X7 Gen 2 visual processor. The realme P4 series smartphones are the first models in the P series to integrate a dedicated visual processor solution aimed at setting a new benchmark for mid-range international market segment. Powered...
Hyundai Mobis has obtained the highest grade of ISO 26262 certification, an international standard for functional safety, for its entire vehicle semiconductor R&D process. It is noted that this rigorous certification was obtained not for specific products, but for the entire process ranging from semiconductor design to quality verification. This certification means that when Hyundai M...
SK hynix Inc. (or 'the company', www.skhynix.com) announced that it has completed development of its 321-layer 2Tb QLC NAND flash product and has begun mass production. This achievement marks the world's first implementation of more than 300 layers using QLC technology, setting a new benchmark in NAND density. The company plans to release the product in the first half of next year foll...
As AI, HPC, and 5G drive semiconductor innovation, advanced packaging has become the next strategic focus. Yole Group projects the market to exceed USD 50 billion by 2025, with fan-out panel-level packaging (FOPLP) growing more than 15% annually. E&R Engineering (TPE: 8027) will present its latest laser and plasma solutions at SEMICON Taiwan 2025, covering FOPLP, Through-Silicon Via (T...
Semiconductor and electronics supply chains are undergoing a major transformation, driven by the rapid growth of artificial intelligence (AI), changing market leadership, and global supply chain relocation, according to DIGITIMES. DIGITIMES vice president Eric Huang highlighted the shift in global industry power before and after the generative AI boom. In 2018, five technology companies ranked ...
PCBAIR, a leading provider of high-precision PCBs, has supported rapid growth in industries such as optical communications, automotive electronics and high-end medical devices by delivering large-scale, precision PCB manufacturing. These demanding sectors require more compact designs, shorter signal paths and enhanced thermal management to meet ever-increasing performance and reliability standar...
ROHM Co., Ltd. has announced that its ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry's lowest operating circuit current (*1). This IC is optimized to be applied as a measurement-sensing amplifier in size-constrained applications such as handheld measurement instruments, wearable devices, and indoor motion detectors. Figures: Product features: https://cdn.kyod...
MetaOptics Ltd (the "Company", together with its subsidiary, the "Group"), a cutting-edge vertically integrated designer and manufacturer of meta optics components and products headquartered in Singapore, has attracted strong support for its initial public offering (the "IPO") and listing of the Company (the "Listing") on the Catalist Board of the Singapore Exchange Securities Trading Limit...
PI (Physik Instrumente), a global leader in precision motion control and nano-positioning technologies, offers its Nanopositioning & Micropositioning Essentials portfolio, delivering core components with reduced lead times and volume discounts tailored for OEMs in research, automation, and advanced manufacturing. This curated Essentials product line features high-precision building blo...
Valens Semiconductor announced that Samsung is supporting the MIPI A-PHY standard for high-speed sensor connectivity and is partnering with Valens Semiconductor to develop the next generation of MIPI A-PHY products, in response to strong market demand from global OEMs. Valens and Samsung have a long history of collaboration. Samsung was among the earlier investors in Valens, and the two co...
MPI Corporation, a global leader in advanced semiconductor test solutions, announced the release of a fully integrated 250 GHz broadband test solution for the new Keysight NA5305A/7A PNA-X Frequency Extender, that builds on its deep expertise in sub-terahertz probing and on-wafer measurements. The new system leverages MPI's TITAN™ RF Probes and probe station platform to de...
DB HiTek, a leading 8-inch specialty foundry, announced it is in the final stages of development of its 650V E-Mode GaN HEMT (Gallium Nitride High-Electron Mobility Transistor) process, a next-generation power semiconductor platform. The company is also to offer a dedicated GaN MPW (multi-project wafer) program at the end of October. Compared with traditional silicon-ba...
According to a recently published report by Dell'Oro Group, the trusted source for market information about the telecommunications, security, networks, and data center industries, the on-going AI expansion cycle drove the server and storage component market to 44 percent year-over-year growth in 2Q 2025. The surging demand for accelerators, HBM, and NICs underpins record expansion across the AI ...
Axera, a leading Chinese AI chip developer, made its debut at IAA Mobility this year, globally launching an ADAS solution based on its M57 SoC, aiming to disrupt the worldwide ADAS market landscape. This solution was developed by Axera in collaboration with industry-leading AI visual perception company STRADVISION, and is compatible with the global ADAS market. This is an all-in-one front-view...
LA Semiconductor LLC ("LA Semiconductor" or "the Company"), a US-owned, fully operational pure-play semiconductor foundry for analog, digital and mixed-signal products, announced it has engaged Macquarie Group to oversee the marketing and sale of its wafer fabrication facility with backend capability located in Pocatello, Idaho. Located on a 31-acre campus, the Pocatello, Idaho fab stands as a ...
OPROCESSOR INC, incorporated in Boston, Massachusetts in 2018 with research operations in Daejeon, South Korea, announced a breakthrough in VCSEL-based Photonic Interposer technology that overcomes the GPU–HBM interconnect bottleneck for next-generation AI and high-performance computing systems. The pioneering work was published in Photonics (MDPI, August 29, 2025) and will be presented a...
Grinn, a full-cycle technology company specializing in the design and development of advanced IoT and embedded solutions, has announced the launch of a strategic partnership with MediaTek which will help it to extend the implementation of advanced AI and IoT technologies based on its off-the-shelf embedded computing systems. The first fruit of the partnership is the creation of a family of ...
WiMi Hologram Cloud Inc., a leading global Hologram Augmented Reality ("AR") Technology provider, announced that they are exploring an innovative solution—Synergic Quantum Generative Network (SQGEN). The core of SQGEN lies in its parallel quantum learning framework. In SQGEN, the generator and discriminator components run simultaneously within a quantum computing environment, interacting t...
iDEAL Semiconductor confirms that its ultra-efficient SuperQ™ silicon power devices are now in production at Polar Semiconductor, a leading foundry specializing in high-voltage, power, and sensor technologies. SuperQ represents the first major innovation in silicon MOSFET architecture in over 25 years. Leveraging a patented asymmetrical RESURF structure, it significantly reduces conductio...
Qnity, DuPont Electronics, ("Qnity"), a premier technology solutions leader across the semiconductor value chain, hosted an Investor Day at the New York Stock Exchange. Video recordings of the presentation are now available to view via web replay on Qnity's Investor Relations site: https://ir.qnityelectronics.com/. This was Qnity's inaugural Investor Day, in advance of the intended separation f...