Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, announced it has been awarded a new development program by the European Space Agency (ESA). The contract, valued at approximately USD $900,000, will span 18 months and support the development of next-generation satellite communication (SATCOM) beamforming integrated circuits (BFICs). "As the only ...
-Marvell Technology, Inc. , a leader in data infrastructure semiconductor solutions, introduced its Golden Cable initiative, a strategic program designed to accelerate and broaden the active electrical cable (AEC) ecosystem and enable faster time-to-market for hyperscaler AI deployments. The program delivers a complete offering with industry-leading software, validated reference designs an...
In a significant step for autonomous driving in Europe, Ruter, the public transport agency of Oslo, Norway, and Holo, a company specialized in the operation of autonomous vehicles, have announced they are partnering with MOIA to deploy the ID. Buzz AD, to be equipped with the Mobileye Drive™ self-driving system, planned for as early as spring 2026. This step follows extensive testing by Ru...
-Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced industry adoption of the Marvell®Alaska® P PCIe retimer product line, which scales connections between AI accelerators, GPUs, XPUs, CPUs, SSDs, CXL devices and other components inside advanced data center systems. Marvell PCIe retimers enable low-power, high-speed and low-latency connectiv...
-Tachyum® announced that it is beginning to take steps to defend the use of its registered TPU® trademark. Tachyum initially applied for trademark status in September 2015 and has held the rights to TPU (for its AI Tachyum Processing Unit) since October 2020. Google recently filed for similar trademark protection of Google TPU for its Tensor Processing Unit on November 21st of this ...
-Dai Nippon Printing Co., Ltd. announced the development of a nanoimprint lithography (NIL) template featuring a circuit line width of 10 nanometers (nm: 10-9 meter). The new template enables patterning for logic semiconductors equivalent to the 1.4nm generation and meets the miniaturization needs of cutting-edge logic semiconductors. Background and Aims In line with the shift to more sophisti...
-Toshiba Electronic Devices & Storage Corporation (”Toshiba”) has added the 40V "TCKE6 series" products to its range of electronic fuses (eFuse ICs) that support multiple functions required for power line circuit protection. The five new products joining the lineup are “TCKE601RA,” “TCKE601RL,” “TCKE602RM,” “TCKE603RA,” and “T...
United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)(“UMC”), a leading global semiconductor foundry, announced a licensing agreement with imec, a world-leading research and innovation hub in advanced semiconductor technologies, for the transfer of imec’s iSiPP300 silicon photonics process, featuring co-packaged optics (CPO) compatibility, to accelerate UMC’s ...
At AWS re:Invent, Amazon Web Services, Inc. (AWS), an Amazon.com, Inc. company (NASDAQ: AMZN), today announced Amazon EC2 M9g instances powered by the new Graviton5 chip. Key takeaways New AWS Graviton5-based Amazon EC2 M9g instances deliver up to 25% higher performance than the previous generation. With 192 cores per chip and 5x larger cache, customers can scale...
Rigaku Corporation, a global solution partner in X-ray analytical systems and a group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”) has launched the XTRAIA MF-3400, an instrument used in semiconductor manufacturing processes to measure the thickness and composition of wafers. The XTRAIA MF-3400 will significantly enhan...
Linear Integrated Systems, Inc., a designer and manufacturer of precision discrete semiconductors, announces the release of the LSBF862, a low noise N-channel JFET engineered to replace and outperform the discontinued NXP BF862. When NXP discontinued the BF862, a popular low-noise N-channel JFET, customers faced lost support for legacy systems, the need to requalify new components, and unplan...
Mitsubishi Electric Corporation (TOKYO: 6503) announced that it has developed the world’s first technology to generate millimeter-scale flow within a channel by using microbubbles with a diameter of 10μm as the driving source. Developed through joint research with Suzuki & Namura Laboratory at Faculty of Engineering and Graduate School of Engineering, Kyoto University, this te...
Murata Manufacturing Co., Ltd. (TOKYO: 6981) (ISIN: JP3914400001) announces the launch and mass production of its multilayer ceramic capacitor (MLCC) featuring a capacitance of 15nF, a rated voltage of 1.25kV, and C0G characteristics in the compact 1210-inch (3.2mm x 2.5mm) size. This product delivers highly efficient power conversion and stable performance under high-voltage conditions, making ...
-Kioxia America, Inc. announced a collaboration between Kioxia Corporation, Tsubakimoto Chain Co. (Tsubakimoto Chain) and EAGLYS Inc. (EAGLYS) to develop AI-driven image recognition technology that automatically identifies products moving through logistics workflows. This system supports advanced automation and efficiency in logistics, enabling organizations to respond quickly to changing...
For highly efficient, reliable inverter systems in railcars and large industrial equipment Mitsubishi Electric Corporation (TOKYO: 6503) announced that it will launch new standard-isolation (6.0kVrms) and high-isolation (10.2kVrms) modules in its 4.5kV/1,200A XB Series of high-voltage insulated-gate bipolar transistors (HVIGBTs) on December 9. These new high-capacity power semiconduct...
STRATIO, a deep-tech company operating between Silicon Valley and Seoul, officially launched its LS SWIR SDK with the world’s first Germanium (Ge)-based short-wave infrared (SWIR) sensor. This milestone furthers the company’s vision “Advance Vision with Infrared-AI™” — a new way of seeing beyond human and conventional visible sensor limits. Unlike traditiona...
Soitec has announced that its SmartSiC technology has successfully completed formal validation for use in next generation silicon carbide power devices, marking a major milestone for the company’s rapidly expanding power electronics business. The validation confirms that SmartSiC substrates meet strict performance, reliability and manufacturability requirements demanded by leading device m...
Sony Semiconductor Solutions Corporation has announced the forthcoming release of the LYTIA 901, a 1/1.12-type large-format mobile image sensor offering approximately 200 effective megapixels. The new flagship device brings together Sony’s next-generation pixel architecture, advanced HDR technologies and an industry-first AI learning-based remosaicing engine mounted directly on the sensor....
Collaboration aims to advance scalable electronically steerable array (ESA) technology for Korea's strategic satellite communications ecosystem Sivers Semiconductors AB (STO:SIVE), a global leader in photonics and wireless technologies, announced a new collaboration with Doosan Corporation, a global leader in advanced materials and manufacturing solutions, to develop scalable...
Breker Verification Systems, whose portfolio solves challenges across the functional verification process for large, complex semiconductors and Frontgrade™ Technologies, a leading provider of high-reliability electronic solutions for space and national security missions today confirmed its RISC-V functional verification solutions were pivotal for verification of the NOEL-V, one of Front...