• Monday | 27 October 2025
Insyde Software Joins Arm Total Design to Accelerate AI-Ready Silicon Innovation

Insyde Software, a leading global provider of UEFI and OpenBMC-based firmware,  announced that it has joined Arm® Total Design, a collaborative ecosystem designed to simplify and accelerate custom silicon development powered by Arm Neoverse™ Compute Subsystems (CSS). In close alignment with Arm’s shift-left approach, Insyde empowers AI infrastructure providers to validate c...

15 Oct 2025 | Wednesday | NEWS
Canaan and Aurora AZ Launch Pilot Project Converting Flared Natural Gas into Low-Cost Power for High-Density Computing

Strategic initiative to convert flared natural gas into low-cost power for high-density computing Scalable low-cost natural gas power model designed to strengthen mining economics Annual reduction of approximately 12,000–14,000 metric tons of CO₂-equivalent emissions expected - Canaan Inc. (NASDAQ: CAN) ("Canaan" or the "Company"), an innovator in crypto mining, announced the lau...

14 Oct 2025 | Tuesday | NEWS
Johnson Controls Expands Silent-Aire Platform with Scalable CDU Solutions for AI-Driven Data Centres in Asia Pacific

Silent-Aire CDUs offer scalable cooling from 500kW to 10MW for high-density data centres in Asia Pacific Flexible, space-saving design with built-in redundancy helps achieve maximum availability and rapid deployment in dense urban markets like Singapore Johnson Controls full thermal portfolio can cut non-IT energy use by up to 50%, boosting efficiency even in warm-climate data cent...

14 Oct 2025 | Tuesday | NEWS
WiMi Explores Quantum Dilated Convolutional Neural Networks to Advance AI Efficiency and Accuracy

WiMi Hologram Cloud Inc. (NASDAQ: WiMi) ("WiMi" or the "Company"), a leading global Hologram Augmented Reality ("AR") Technology provider, today announced that active exploration is underway in the field of Quantum Dilated Convolutional Neural Networks (QDCNN) technology. This technology is expected to break through the limitations of traditional convolutional neural networks in handling complex d...

14 Oct 2025 | Tuesday | NEWS
Kioxia Expands RocksDB Plug-In to Boost SSD Performance and Lifespan in RAID Configurations

  Kioxia Corporation, announced an expanded RocksDB plug-in that enhances SSD lifespan and performance in multi-drive RAID environments. Building on its earlier demonstration of a Flexible Data Placement (FDP)-enabled SSD running RocksDB, the company will showcase this advancement at the upcoming Open Compute Project (OCP) Global Summit. In a 4-drive RAID 5 setup, Kioxia’s new plug-in...

13 Oct 2025 | Monday | NEWS
Quilter Raises $25 Million from Index Ventures to Revolutionise Hardware Design with Physics-Driven AI

Index Ventures backs Quilter to automate circuit board design, a trillion-dollar bottleneck found in everything from phones to fighter jets. Quilter, the first and only company to publicly demonstrate fully autonomous PCB layout through physics-driven AI, announced $25 million in Series B funding led by Index Ventures. The investment comes as Fortune 500 aerospace, defense, and consum...

9 Oct 2025 | Thursday | NEWS
Global 300mm Fab Equipment Investments to Reach $374 Billion by 2028, Driven by AI and Regional Self-Sufficiency

SEMICON West -- Global 300mm fab equipment spending is expected to reach $374 billion from 2026 to 2028, SEMI reported  in its latest 300mm Fab Outlook. This robust investment reflects fab regionalization and surging AI chip demand for data centers and edge devices, while underscoring the growing commitment to semiconductor self-sufficiency across key regions through localized ind...

9 Oct 2025 | Thursday | Reports
Semtech Launches Next-Generation 5G AirLink® Routers with Network Slicing for Mission-Critical Public Safety Operations

New Generation of Purpose-Built Routers With 5G Network Slicing Support Enables Dedicated Connectivity Lanes for Mission-Critical First Responder Operations Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, today announced the availability of the AirLink® XR80 and XR9...

8 Oct 2025 | Wednesday | NEWS
HAP International Advances Toward Agreement with U.S. Customs for TRACE ID Supply Chain Traceability Program

HAP International announced  that following a successful technical assessment of the quality and scope of shipment-level traceability data provided by the TRACE ID program, they are taking steps toward a formal Memorandum of Agreement with U.S. Customs and Border Protection (CBP). The initiative builds on CBP’s ongoing Global Business Identifier (GBI) test and reflects the agency&rsqu...

8 Oct 2025 | Wednesday | NEWS
OMNIVISION Expands TheiaCel™ Portfolio with OX08D20 for Advanced Driver Assistance and AD Systems

OMNIVISION, a leading global developer of semiconductor technology, including advanced digital imaging, analog and display solutions, announced today its latest-generation automotive image sensor: the OX08D20 8-megapixel (MP) CMOS image sensor with TheiaCel™ technology. This new device is an upgrade to the popular OX08D10 sensor for exterior cameras used in advanced driver assistance syste...

8 Oct 2025 | Wednesday | NEWS
Advanced Energy Launches 401M Mid-Infrared Pyrometer for Next-Generation Semiconductor Precision

Advanced Energy Industries, Inc. (Nasdaq: AEIS), a global leader in highly engineered, precision power conversion, measurement and control solutions, announces the launch of the 401M mid-infrared optical pyrometer, designed for high-precision, non-contact temperature measurement in semiconductor and industrial process environments. The 401M debuts at SEMICON® West 2025. Engineered for speed...

8 Oct 2025 | Wednesday | NEWS
Altera and BigCat Wireless Expand Alliance to Power the Next Wave of FPGA-Based Open RAN and SatCom Innovation

  Altera Corporation, a global leader in FPGA-based solutions, and BigCat Wireless, specializing in advanced wireless communications solutions, today announced an expanded partnership to scale Altera’s FPGA-based radio access network technology to wireless customers. Under this agreement, BigCat Wireless becomes an official solutions integrator for Altera’s Open Radio Unit (O-RU)...

8 Oct 2025 | Wednesday | NEWS
Alchip’s 3DIC Validation Paves Way for 2nm–3nm Stacked Architectures

Alchip Technologies, the dedicated high-performance and AI computing ASIC leader, validated its 3DIC ecosystem readiness with results from its 3DIC test chip tape out. The results vaulted Alchip into a clear 3DIC technology leadership because it validated an entire, integrated 3DIC solution, as well as its various elements.  The test chip provided CPU/NPU core demonstration, UCIe and PCIe ...

6 Oct 2025 | Monday | NEWS
L&T Technology Services Secures $100 Million Multi-Year Deal to Accelerate AI-Driven Innovation for Semiconductor Equipment Client

-L&T Technology Services Limited , a global leader in AI, Digital & ER&D Consulting Services,  announced a major milestone in its Sustainability segment with the signing of a $100 million multi-year agreement with a US-based industrial equipment manufacturer catering to the semiconductor value chain. Under the terms of the agreement, LTTS will support the clients’ initiat...

2 Oct 2025 | Thursday | NEWS
Sony Unveils IMX775: Industry’s Smallest 2.1 µm Pixel RGB-IR Image Sensor for In-Cabin Monitoring

Sony Semiconductor Solutions Corporation (Sony)  announced the upcoming release of the IMX775 CMOS RGB-IR image sensor with the industry's smallest[*1] pixel size of 2.1 µm, delivering both RGB and IR imaging on a single chip and a resolution of approximately 5 effective megapixels,[*2] designed for in-cabin monitoring cameras. *1  Among CMOS image sensor...

2 Oct 2025 | Thursday | NEWS
Mitsubishi Electric Develops Contactless Sensor for Continuous Monitoring of Vital Body Data

  Mitsubishi Electric Corporation  announced  that it has developed a new type of contactless body data sensor that can detect minute variations in heart rates, respiration, and other vital body indicators with high precision. It will enable the continuous and accurate daily measurement of such data in situations where the use of contact-type sensors, such as smartwatches, may be d...

1 Oct 2025 | Wednesday | NEWS
ShunYun Technology and NewPhotonics Forge Strategic OSAT Partnership to Accelerate High-Volume PIC Manufacturing

ShunYun Technology Ltd (SYT), a world-class manufacturer of optical transceivers, and NewPhotonics, a leading designer of highly integrated photonic integrated circuit (PIC) chips for data center optical interconnect, today announced a strategic OSAT partnership for volume manufacturing of the NewPhotonics NPG product line. Ethernet pluggable optics are forecasted to scale to >100 million by...

1 Oct 2025 | Wednesday | NEWS
NEPCON ASIA 2025 Set to Ignite Innovation in Electronics Manufacturing at Shenzhen World Expo

Taking place from October 28 to 30, 2025 at the Shenzhen World Exhibition & Convention Center (Bao'an), NEPCON ASIA is the premier platform to discover the latest technologies and market trends, connect with new suppliers and products, and explore potential partnerships and distribution opportunities. Featuring an ever-expanding showcase of automation equipment and technologies, the ...

28 Sep 2025 | Sunday | NEWS
SK keyfoundry and LB Semicon Co-Develop High-Reliability Direct RDL Technology for Automotive and Next-Gen Semiconductor Packaging

SK keyfoundry, an 8-inch pure-play foundry in Korea, announced that it has successfully co-developed core technology and completed reliability testing of Direct RDL (Redistribution Layer) – a core semiconductor packaging technology based on 8-inch wafers – in collaboration with LB Semicon. This achievement marks a significant step forward in advancing next-generation semiconductor pa...

28 Sep 2025 | Sunday | NEWS
InPsytech Tapes Out UCIE 2.0-Compliant Design on TSMC's SoIC F2F Technology

InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced design for TSMC's Face-to-Face (F2F) SoIC technology, fully compliant with the UCIE 2.0 (Universal Chiplet Interconnect Express) standard. This milestone marks a significant achievement in enabling high-speed interconnects for heterogene...

28 Sep 2025 | Sunday | NEWS

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