• Monday | 09 February 2026
Murata Launches 1.25kV C0G MLCC in Compact 1210 Size for SiC-Based Power Systems

Murata Manufacturing Co., Ltd. (TOKYO: 6981) (ISIN: JP3914400001) announces the launch and mass production of its multilayer ceramic capacitor (MLCC) featuring a capacitance of 15nF, a rated voltage of 1.25kV, and C0G characteristics in the compact 1210-inch (3.2mm x 2.5mm) size. This product delivers highly efficient power conversion and stable performance under high-voltage conditions, making ...

3 Dec 2025 | Wednesday | NEWS
Mitsubishi Electric Launches New 4.5kV/1,200A HVIGBT Modules With Enhanced Isolation and Moisture Resistance

For highly efficient, reliable inverter systems in railcars and large industrial equipment Mitsubishi Electric Corporation (TOKYO: 6503) announced that it will launch new standard-isolation (6.0kVrms) and high-isolation (10.2kVrms) modules in its 4.5kV/1,200A XB Series of high-voltage insulated-gate bipolar transistors (HVIGBTs) on December 9. These new high-capacity power semiconduct...

3 Dec 2025 | Wednesday | NEWS
Tower Semiconductor Gains Nearly 5% After Revealing New Manufacturing Collaborations

Tower Semiconductor (NASDAQ/TASE: TSEM), a leading foundry of high-value analog semiconductor solutions, saw its stock rise approximately 5%  after unveiling a series of new strategic collaborations aimed at expanding its chip-manufacturing capabilities and strengthening its global technology roadmap. The market responded positively to Tower’s newly announced partnerships, which are ...

1 Dec 2025 | Monday | NEWS
Micron to Invest $9.6 Billion in New AI Memory Chip Plant in Japan

Micron Technology, Inc., a global leader in memory and storage solutions, today announced plans to invest $9.6 billion in the construction of a new advanced semiconductor fabrication facility in Hiroshima, Japan. The new plant will focus on producing next-generation high-bandwidth memory (HBM) chips designed to power the world’s rapidly expanding artificial intelligence (AI) and high-perfo...

1 Dec 2025 | Monday | NEWS
TDK Corporation and Nippon Chemical Industrial Begin Discussions on Joint Venture for Advanced Electronic Component Materials

TDK Corporation and Nippon Chemical Industrial Co., Ltd. have announced the signing of an agreement to begin formal discussions toward establishing a joint venture dedicated to next generation electronic component materials. The proposed venture would focus on the co development and manufacturing of ceramic materials for multilayer capacitors as well as other high value materials essential to se...

28 Nov 2025 | Friday | NEWS
Sony Introduces LYTIA 901, a Large Format Mobile Sensor with Two Hundred Megapixel Power

Sony Semiconductor Solutions Corporation has announced the forthcoming release of the LYTIA 901, a 1/1.12-type large-format mobile image sensor offering approximately 200 effective megapixels. The new flagship device brings together Sony’s next-generation pixel architecture, advanced HDR technologies and an industry-first AI learning-based remosaicing engine mounted directly on the sensor....

28 Nov 2025 | Friday | NEWS
Fujifilm Completes New Building to Boost Its Semiconductor Materials Business

Fujifilm has announced the completion of a new state-of-the-art building at its Shizuoka site in Japan, marking a significant expansion of its semiconductor materials operations. The facility is designed to strengthen the company’s research, development and quality-evaluation capabilities as global demand for sophisticated chipmaking materials continues to rise. Situated within the Fujifi...

28 Nov 2025 | Friday | NEWS
Shin-Etsu Chemical’s 300-mm QST™ Substrate Enables IMEC to Achieve World-Record 800V GaN HEMT Breakdown Voltage

The QSTTM substrate*1, a 300-mm GaN growth substrate that Shin-Etsu Chemical Co., Ltd. (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) developed, has been adopted for the 300-mm GaN power device development program at IMEC*2, where sample evaluation is in progress. In the evaluation, the 5 µm-thick HEMT*3 device using a QSTTM substrate achiev...

17 Nov 2025 | Monday | NEWS
Taiyo Holdings and imec Demonstrate Breakthrough Fine-Pitch RDL Material for Next-Generation Semiconductor Packaging

Taiyo Holdings Co., Ltd. (Securities Code: 4626; hereinafter referred to as "Taiyo Holdings"), based in Tokyo, presented a paper, co-authored with imec, one of the world's largest semiconductor research institutions, at the 14th IEEE CPMT Symposium Japan (ICSJ2025), focusing on the "FPIM (TM) Series" (hereinafter referred to as "this material"), a negative-type photosensitive insula...

14 Nov 2025 | Friday | NEWS
Renesas Sets New Standard for DDR5 Memory Interfaces with 9600 MT/s RCD Optimized for AI and HPC Workloads

Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, announced that it has delivered the industry’s first sixth-generation Registered Clock Driver (RCD) for DDR5 Registered Dual In-line Memory Modules (RDIMMs). The new RCD is the first to achieve a data rate of 9600 Mega Transfers Per Second (MT/s), surpassing the industry standard. This brea...

13 Nov 2025 | Thursday | NEWS
Samsung Electro-Mechanics and Sumitomo Chemical Group Strengthen Strategic Collaboration on Glass Core Substrates

Strengthening strategic cooperation for next-generation semiconductor package core material 'Glass Core' Aiming to lead the glass substrate market by combining strengths in preparation for the AI era Samsung Electro-Mechanics announced on the 5th that it has signed a memorandum of understanding (MOU) with Sumitomo Chemical Group to establish a joint venture (JV) for man...

7 Nov 2025 | Friday | NEWS
Magnachip and Hyundai Mobis Advance Next-Gen IGBT Technology for Electric Vehicle Traction Systems

Magnachip Semiconductor Corporation (NYSE: MX) (“Magnachip” or the “Company”)  announced it has concluded an agreement with Hyundai Mobis Company Limited (hereinafter “MOBIS”) regarding the use of high-performance Insulated Gate Bipolar Transistor (IGBT) technology, and plans to expand its business based on this technology. Hyundai Mobis is a global auto ...

5 Nov 2025 | Wednesday | NEWS
Toshiba Launches S300 AI High-Capacity Surveillance HDDs Built for the AI-Driven Era

The new high-capacity, high-performance storage is purpose-built for the demands of modern AI-enabled surveillance systems Toshiba Electronic Devices & Storage Corporation (Toshiba) has introduced S300 AI, a new generation of surveillance hard disk drives (HDDs) engineered for the requirements of modern artificial intelligence (AI) driven video applications. Purpose-built for high...

5 Nov 2025 | Wednesday | NEWS
Canaan Deploys Hydro-Cooled Avalon® A1566HA Servers at Major Japanese Utility

Hydro-cooled Avalon® A1566HA servers deployed at major Japanese utilityProject underscores Canaan's ability to support grid efficiency amid rising residential and data-center power demand Canaan Inc., an innovator in crypto mining, announced a 4.5-megawatt sales contract with an electrical engineering solutions provider to deploy Avalon A1566HA-488T hydro-cooled mining servers for real-time...

31 Oct 2025 | Friday | NEWS
Delta Electronics Acquires Full Ownership of Japan’s Noda RF Technologies to Strengthen Semiconductor Power Solutions

Delta Electronics, Inc. ("Delta"), a leader in power management and smart green solutions, announced the acquisition of 90.23% stake of Japan's Noda RF Technologies Co., Ltd. ("NRF") through its subsidiary Delta Electronics (Netherlands) B.V. for JPY 5,024 million (approximately NT$1,034 million). Combined with its existing stake, Delta will hold 100% ownership of NRF upon completion of the tran...

30 Oct 2025 | Thursday | NEWS
Toshiba Expands High-Speed Digital Isolator Lineup with New Dual-Channel DCL52xx00 Series for Industrial Equipment

-Toshiba Electronic Devices & Storage Corporation("Toshiba") has launched four dual-channel, high-speed standard digital isolators for industrial equipment. The new “DCL52xx00 Series” products support stable operation with high common mode transient immunity (CMTI) of 100kV/μs (typ.)[1] and high-speed data rate of 150Mbps (max). Shipments start today. The channel configuratio...

29 Oct 2025 | Wednesday | NEWS
Socionext Introduces “Flexlets,” a New Class of Configurable Chiplets to Advance Heterogeneous Integration

Socionext Inc., a global leader in System-on-Chip (SoC) design and advanced semiconductor solutions, introduces "Flexlets", a new class of configurable chiplets designed to advance heterogenous integration.  As traditional monolithic SoC designs face physical and economic limits—reticle size constraints, yield challenges, and thermal bottlenecks- the industry is turning toward c...

29 Oct 2025 | Wednesday | NEWS
Sony Introduces IMX828, Industry’s First Automotive CMOS Image Sensor With Built-In MIPI A-PHY Interface

Delivering high HDR performance and low power consumption for next-generation automotive cameras Sony Semiconductor Solutions Corporation (Sony)  announced the upcoming release of the IMX828, the industry's first*1 CMOS image sensor for automotive applications with a built-in MIPI A-PHY interface. There are multiple high-speed transmission interface standards for automotive applications. T...

29 Oct 2025 | Wednesday | NEWS
Renesas Expands RA8 Series with 1 GHz Cortex-M85 MCUs for AI, Industrial and Graphics-Driven Applications

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, introduced the RA8M2 and RA8D2 microcontroller (MCU) groups. Based on a 1 GHz Arm® Cortex®-M85 processor with an optional 250 MHz Arm®Cortex®-M33 processor, the new MCUs are the latest Renesas offerings to deliver an unmatched 7300 Coremarks of raw compute performance, the industry...

23 Oct 2025 | Thursday | NEWS
Rigaku Establishes Rigaku Technology Taiwan to Strengthen Regional Innovation and Customer Support Across Semiconductors, Materials, and Life Sciences

Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”) hereby announces the establishment of Rigaku Technology Taiwan Co., Ltd. (hereinafter “RTTW”), a new group company in Taiwan, in 2025. A facility within RTTW, Rigaku Technology Center Taiwan (hereinafter RTC-TW), began full-scale operation in October 2025. RTTW will assum...

22 Oct 2025 | Wednesday | NEWS

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