• Monday | 09 February 2026
Magic Eye Introduces Next-Generation ILT™ Evaluation Platform for Real-Time 3D Depth Sensing

Magic Eye a developer of advanced 3D depth sensing technology based on ILT™ (Invertible Light Technology) , will unveil a new high-resolution, real-time ILT evaluation system at the upcoming Consumer Electronics Show (CES) designed to enable customers to evaluate ILT performance, validate configurations and begin application development for robotics, low-cost LiDAR-class replacement and auto...

22 Dec 2025 | Monday | NEWS
MemryX Partners with Macnica to Expand Edge-AI Accelerator Adoption in Japan

MemryX Inc., a leading provider of high-performance AI accelerators for edge devices, announced a distribution and solutions partnership with Macnica, Inc., one of Japan's largest semiconductor distributors. The agreement builds on more than a year of collaboration supporting customer engagements across Japan's growing edge-AI markets and strengthens both companies' ability to scale deployments a...

22 Dec 2025 | Monday | NEWS
Open POWER Foundation Announces Winners of Microwatt Design Challenge

Open POWER Foundation, an open developer community for the POWER ISA, announces the winners of the Microwatt Design Challenge (Microwatt Momentum Hackathon), in collaboration with ChipFoundry. The challenge was open to a broad range of participants including hardware engineers, students, researchers, and developers within the Open POWER ecosystem. The Open POWER Foundation, in collaboration with ...

22 Dec 2025 | Monday | NEWS
AP Memory Advances S-SiCap™ Silicon Capacitor Portfolio for AI Servers and HPC Systems

AP Memory, a leading global design company providing customized memory solutions, today announced further advancements in its S-SiCapTM (Stack Silicon Capacitor) product line to address the increasing integration demands of AI servers and high-performance computing (HPC) systems. The S-SiCapTM portfolio includes two product categories —discrete silicon capacitors and interposers with silicon...

19 Dec 2025 | Friday | NEWS
Meridian Innovation Launches Cheetah™ 50×50 LWIR Thermal Imaging Sensor for Mass-Market Adoption

Meridian Innovation, a global leader in CMOS-based thermal imaging solutions, is excited to announce the launch of Cheetah, a breakthrough 50×50 LWIR thermal imaging sensor engineered to deliver a new level of performance, compactness, and affordability for mass-market applications. Built on Meridian's proven SenXor® technology platform, Cheetah offers unrivalled price-performance, enab...

19 Dec 2025 | Friday | NEWS
SK Hynix Validates Industry-First 256GB DDR5 RDIMM with Intel Xeon 6 Platform

SK hynix 32Gb 1b die-based 256GB server DDR5 RDIMM completes compatibility validation with Intel Xeon 6 platform- Demonstrates world-leading expertise in high-capacity DDR5 module technology- SK hynix to proactively enhance customer satisfaction as a "Full-stack AI memory creator" SK hynix Inc. announced that it has become the first in the industry to complete the Intel Data Center Certified...

19 Dec 2025 | Friday | NEWS
Kioxia Brings Cost-Efficient, Scalable Vector Search to the Milvus Ecosystem

Kioxia Corporation announced that its Nearest Neighbor Search (ANNS) software technology, KIOXIA AiSAQ™, has been officially integrated into the open-source vector database starting with Milvus version 2.6.4. This integration allows Milvus users to fully leverage KIOXIA AiSAQ™'s SSD-optimized vector search capabilities, providing developers and enterprises with a practical and cost-eff...

19 Dec 2025 | Friday | NEWS
Qualcomm Finalizes Alphawave Semi Acquisition to Accelerate Data Center Expansion

Qualcomm Incorporated (NASDAQ: QCOM) announced that it has completed its acquisition of Alphawave IP Group plc (AWE.L) (“Alphawave Semi”), approximately one quarter ahead of schedule. The acquisition of Alphawave Semi aims to further accelerate and provide key assets for Qualcomm's expansion into the data center. Tony Pialis, CEO and co-founder of Alphawave Semi, will lead the Qualcomm...

19 Dec 2025 | Friday | NEWS
Rigaku Introduces ONYX™ 3200 for High-Precision Semiconductor Bump and BEOL Metrology

Rigaku Corporation, a global partner in X-ray analytical systems solutions and a Rigaku Holdings Corporation company (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”), announced the launch of the ONYX 3200, a new semiconductor metrology system for measuring the thickness, composition, and bump structures* in wafer-level processes. The system is designed to help m...

19 Dec 2025 | Friday | NEWS
AKM and Aizip Partner to Advance AI-Enhanced Sensing for Digital Health and Wearables

-Asahi Kasei Microdevices (AKM) and Aizip have partnered to showcase two innovations in AI-enhanced sensing: real-time swallowing detection using millimeter-wave radar and gesture recognition utilizing electromyography (EMG). This collaboration pairs AKM’s sensing hardware with Aizip’s lightweight artificial intelligence (AI) models to provide manufacturers with solutions that don&rs...

18 Dec 2025 | Thursday | NEWS
AI Boom Powers Three-Year Surge in Semiconductor Equipment Spending Through 2027

Growth Supported by Leading-edge Logic, Memory and Advanced Packaging Applications from 2025 through 2027 Global sales of total semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecast to reach a record high of $133 billion in 2025, growing 13.7% year-on-year, SEMI announced today in its Year-End Total Semiconductor Equipment Forecast – OEM Perspective...

17 Dec 2025 | Wednesday | NEWS
Toppan Advances Semiconductor Packaging And Photomask Strategy

  Toppan has outlined a sharpened semiconductor strategy that places advanced packaging and next generation photomask technologies at the heart of its growth roadmap, aligning the business more closely with accelerating global demand for artificial intelligence driven computing. The company is recalibrating its semiconductor portfolio to address the increasing complexity of chip architectur...

16 Dec 2025 | Tuesday | NEWS
SEMIFIVE Secures Multiple AI Chip Design Wins in Japan, Establishes Tokyo Subsidiary

  - Demonstrates end-to-end expertise in high-performance custom chip design for AI and HPC- Establishes a subsidiary in Japan to strengthen global reach SEMIFIVE, a global leader in custom AI semiconductor (ASIC) design preparing for its KOSDAQ listing, announced that it has secured multiple AI semiconductor design projects in Japan and recently established its subsidiary in Tokyo, Japan. ...

15 Dec 2025 | Monday | NEWS
Dai Nippon Printing unveils 10nm NIL template for 1.4nm generation logic semiconductors

-Dai Nippon Printing Co., Ltd. announced the development of a nanoimprint lithography (NIL) template featuring a circuit line width of 10 nanometers (nm: 10-9 meter). The new template enables patterning for logic semiconductors equivalent to the 1.4nm generation and meets the miniaturization needs of cutting-edge logic semiconductors. Background and Aims In line with the shift to more sophisti...

10 Dec 2025 | Wednesday | NEWS
Toshiba adds 40V TCKE6 series eFuse ICs with advanced protection features

-Toshiba Electronic Devices & Storage Corporation (”Toshiba”) has added the 40V "TCKE6 series" products to its range of electronic fuses (eFuse ICs) that support multiple functions required for power line circuit protection. The five new products joining the lineup are “TCKE601RA,” “TCKE601RL,” “TCKE602RM,” “TCKE603RA,” and “T...

10 Dec 2025 | Wednesday | NEWS
Rapidus To Build 1.4 Nm Advanced Chip Fabrication Facility In Japan By 2027

Japanese semiconductor start up Rapidus has announced plans to construct a 1.4 nm process node fabrication facility, marking a bold step in the country ambition to re enter the front ranks of advanced global chip manufacturing. Research and development activities for the facility are expected to begin in 2026, with volume production targeted for 2029. Once operational, the plant is ...

9 Dec 2025 | Tuesday | NEWS
Rigaku Launches XTRAIA MF-3400 to Enable Nanoscale Film Measurement for Next-Generation Semiconductor Manufacturing

Rigaku Corporation, a global solution partner in X-ray analytical systems and a group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”) has launched the XTRAIA MF-3400, an instrument used in semiconductor manufacturing processes to measure the thickness and composition of wafers. The XTRAIA MF-3400 will significantly enhan...

8 Dec 2025 | Monday | NEWS
Mitsubishi Electric Develops World’s First Microbubble-Driven Millimeter-Scale Flow Technology for Next-Generation Electronic Cooling

Mitsubishi Electric Corporation (TOKYO: 6503) announced  that it has developed the world’s first technology to generate millimeter-scale flow within a channel by using microbubbles with a diameter of 10μm as the driving source. Developed through joint research with Suzuki & Namura Laboratory at Faculty of Engineering and Graduate School of Engineering, Kyoto University, this te...

5 Dec 2025 | Friday | NEWS
Asahi Kasei Divests Daramic Lead Battery Separator Business to Kingswood Capital as Part of Strategic Portfolio Realignment

Asahi Kasei, a diversified global manufacturer in the Healthcare, Homes, and Material sectors, announces its strategic divestiture of Daramic, a lead battery separator business, to Kingswood Capital Management, LP. The Daramic business transfer closed on December 1, 2025. The effect on Asahi Kasei’s consolidated financial results for fiscal 2025 is immaterial. “As we enter a new era...

4 Dec 2025 | Thursday | NEWS
Kioxia Corporation Announces Clean-Power Collaboration With Google to Accelerate Hydropower Adoption in Japan

As part of its commitment towards a more sustainable future, Kioxia Corporation (“Kioxia”) today announced a collaborative initiative with Google LLC (“Google”) to boost its use of the clean electricity generated by a hydropower retrofit project in Japan's Chubu region. This project, owned by the Chubu Electric Power group, is expected to increase annual clean energy gene...

4 Dec 2025 | Thursday | NEWS

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