BTU Expands Reflow Technology with Advanced Formic Acid Capability
New fluxless reflow solution targets advanced semiconductor packaging, power electronics and high-reliability applications with improved process control and oxidation management.
BTU International has introduced a new Formic Acid Reflow capability across several of its reflow oven platforms, targeting the growing requirements of advanced semiconductor packaging, power electronics and high-reliability electronic assemblies. The technology enables fluxless soldering while providing tighter process control, improved solder joint quality and the potential to reduce operating costs.
As semiconductor packages become smaller and increasingly complex, manufacturers are facing greater challenges in controlling oxidation, contamination and process variability. BTU's new solution creates an ultra-low-oxygen environment inside the reflow chamber, with oxygen concentrations reaching single-digit parts per million. This controlled atmosphere is designed to improve solder wetting and deliver more consistent and repeatable results during assembly.
Rather than applying formic acid throughout the complete thermal cycle, BTU uses targeted process zones to introduce the chemistry only where oxide removal is required. This approach reduces formic acid consumption while maintaining effective oxide reduction, helping manufacturers lower operating costs and improve the efficiency of the reflow process.
The capability is available across multiple BTU reflow platforms, giving manufacturers flexibility to select equipment according to their individual production requirements. It is also compatible with BTU's TrueFlat technology, which is designed to manage substrate warpage during processing. The combination is particularly suited to thin substrates, advanced IC packages and AI-related devices where maintaining thermal uniformity and dimensional stability is increasingly important.
BTU said the technology responds to the industry's shift towards finer interconnects, thinner substrates and higher reliability standards. By combining precise atmosphere control with efficient formic acid delivery and established thermal processing technologies, the company aims to provide manufacturers with a scalable solution for fluxless semiconductor assembly.
The new capability is intended for applications including advanced packaging, power devices and other electronic assemblies where oxidation control, clean processing and reliable solder connections are critical.
