Montage Technology Begins Trial Production of Industry-First CXL 3.2 Memory Expander Controller for AI Data Centres
New PCIe 6.0-based MXC chip enables high-capacity memory expansion and pooling, with Samsung and SK hynix validation supporting next-generation AI and cloud infrastructure.
Montage Technology announced the industry's first trial production of its CXL® 3.2 Memory eXpander Controller (MXC) chip, designed to address escalating demands for memory expansion and resource pooling in AI, cloud computing, and data centre environments. Leveraging CXL technology, the MXC chip enables customers to build memory infrastructure with higher capacity, improved resource utilisation, and greater flexibility.
The CXL 3.2 MXC complies with CXL Type 3 specifications, including both CXL.mem and CXL.io protocols. It is designed with PCIe® 6.x and CXL 3.2 protocol support, delivering data transfer rates of up to 64 GT/s. The chip integrates dual DDR5 memory controllers that support up to 8000 MT/s DDR5 memory. By converting host-side CXL memory requests into DDR commands in real time, it enables efficient data exchange between the host and backend memory, effectively breaking through the memory capacity limits of traditional servers.
Additionally, the chip integrates PCIe 6.x PHY, DDR5 PHY, dual RISC-V processor subsystems, and a comprehensive set of management interfaces. It supports multiple CXL memory expansion form factors, including PCIe AIC cards and EDSFF modules, providing critical support for emerging memory applications such as memory expansion, pooling, and tiered memory architectures.
"The trial production of the CXL 3.2 MXC chip marks an important milestone in Montage Technology's pursuit of CXL innovation and commercialisation," said Stephen Tai, President at Montage Technology. "As memory demands continue to surge in the AI era, we are providing our customers with high-bandwidth, large-capacity, and highly reliable memory expansion solutions, accelerating the large-scale adoption of CXL in data centre and AI infrastructure."
In addition to the chip, Montage Technology provides a complete software development kit (SDK) along with analysis and testing tools to help customers accelerate product development, compatibility validation, and mass production. The CXL 3.2 MXC has already been integrated into next-generation CXL products by leading memory module manufacturers, including Samsung and SK hynix, with initial validation successfully completed. The solution is designed to align with leading server platforms, including Intel® Xeon® and AMD EPYC™, to ensure broad interoperability and optimal performance.
