StratEdge Introduces Gold-Plated Tabs for High-Power GaN Semiconductor Packaging
New die-on-tab solution supports eutectic die attach, improving thermal and electrical performance for RF, microwave, phased-array and high-power semiconductor applications.
StratEdge Corporation, a leader in the design and production of high-frequency, high-power, and high-reliability packages, offers gold-plated tabs for advanced semiconductors that require superior thermal and electrical performance.
StratEdge’s gold-plated tabs are designed to support eutectic die attach for gallium nitride (GaN) and other high-power devices using gold-tin (AuSn) and gold-silicon (AuSi) solders. The tabs provide a practical die-on-tab solution for applications where direct eutectic attach to an organic board is not suitable due to temperature limitations.
For chip-on-board applications, the semiconductor chip is attached to the thermally conductive tab before the tab is installed onto the board. This approach helps protect temperature-sensitive board materials while supporting the performance requirements of high-frequency and high-power devices. Designers of phased arrays may want to use the board to combine multiple antenna elements when space is often limited.
“Gold-plated tabs give engineers a reliable path for integrating advanced devices into demanding RF, microwave, and power applications,” said Casey Krawiec, vice president of Global Sales at StratEdge. “For high-power density semiconductors, having a reliable first-level interface is extremely important. Our tabs help our customers achieve this.”
