Advanced Packaging Surges Past $50B as E&R Engineering Showcases Next-Gen Solutions at SEMICON Taiwan 2025

As AI, HPC, and 5G drive semiconductor innovation, advanced packaging has become the next strategic focus. Yole Group projects the market to exceed USD 50 billion by 2025, with fan-out panel-level packaging (FOPLP) growing more than 15% annually.

E&R Engineering (TPE: 8027) will present its latest laser and plasma solutions at SEMICON Taiwan 2025, covering FOPLP, Through-Silicon Via (TSV), Through-Glass Via (TGV), and plasma dicing. These fully integrated process technologies help customers manage high I/O density, warpage control, and ultra-fine features.

E&R provides a full equipment portfolio, including laser marking, dicing, plasma cleaning, laser debonding, and ABF drilling, supporting panels up to 700×700 mm. With precision control, the systems maintain productivity while stably processing substrates with warpage up to 16 mm.