Halo Industries Selects Eyelit Technologies MES Platform for SiC Wafer Production
Manufacturing execution system will support scaling of laser-based silicon carbide wafering technology.
Eyelit Technologies (Eyelit), a leader in optimised planning, scheduling, and execution systems for manufacturers, announced that Halo Industries, an innovator in laser-based silicon carbide (SiC) wafering, has selected Eyelit’s solution suite to support its rapidly scaling production needs.
Eyelit was chosen following a competitive evaluation, with Halo Industries selecting the platform based on its strong reputation, composable architecture, and flexible application capabilities. The decision reflects Halo’s need for a system that is appropriately sized for its current operations but robust and scalable enough to support future growth as the company advances its cutting-edge SiC wafering technology.
Eyelit’s Manufacturing Execution System (MES) suite stood out for several reasons: its proven scalability, unmatched flexibility in recipe and dynamic flow configuration using the Scenarios feature, and the unique IP Shield capability to protect proprietary process data. The system also came highly recommended by other current and former Eyelit users, reinforcing its reputation for performance in high-tech manufacturing environments.
“I’ve worked with Eyelit in the past, and their architecture and flexibility continue to stand out,” said Tim Irvine, MES Production Manager at Halo Industries. “Other MES vendors either weren’t the right fit for our size or couldn’t scale with us. Eyelit’s platform gives us the right balance of control, flexibility, and futureproofing, especially with features like Scenarios and IP Shield that no one else offered.”
“Halo Industries is pioneering a breakthrough in silicon carbide wafering, and we are honored to partner with them on this journey,” said Joe Bellini, CEO of Eyelit Technologies. “Our solution architecture, with flexible recipe flows, composable applications, and robust IP protection via IP Shield, will provide Halo the control, scalability, and agility they need as they push the boundaries of laser‑based wafering.”
