SiMa.ai Launches Modalix™ MLSoC to Power Physical AI at the Edge Under 10 Watts

Modalix™, a second-generation Machine Learning System on a Chip (MLSoC™) purpose built to lead the Physical AI industry, delivers industry-leading performance and accuracy without sacrificing power—supporting LLMs, transformers, CNNs, and GenAI workloads under 10 watts. Its flexible, Arm-based architecture with a native GenAI stack enables real-time perception, decision-making, and natural language interaction. Modalix supports all essential interfaces—camera, Ethernet, PCIe, and more—making it ideal for scaling Physical AI across robotics, automotive, industrial automation, aerospace and defense, smart vision and retail, and medical applications.

"SiMa.ai's Modalix showcases the scale of innovation that's possible building on Arm's flexible, high-performance, power-efficient compute platform," said Ami Badani, Chief Marketing Officer, Arm. "By bringing AI and LLM capabilities to Physical AI applications at the edge, SiMa.ai is enabling smarter, faster, and more sustainable systems across industries."

SiMa.ai leveraged Synopsys' industry-leading AI-powered EDA suite, broad IP portfolio, and architecture design and emulation solutions to accelerate development and achieve bug-free A0 silicon, enabling faster, more confident production.

"The development of Physical AI applications requires validated, purpose-built silicon and software that is only possible using the most advanced design solutions," said Ravi Subramanian, Chief Product Management Officer, Synopsys. "Achieving a successful first tapeout of MLSoC Modalix illustrates the mission-critical role of Synopsys AI-powered design and IP to achieve complex SoC requirements. Together, Synopsys and SiMa.ai are enabling customers to bring their bleeding-edge AI innovations to market faster and with confidence."

TSMC's advanced N6 process ensured Modalix meets the stringent power, thermal, and reliability demands of embedded deployments. 

"TSMC is proud to deepen our collaboration with industry innovators like SiMa.ai to deliver advanced SoCs enabled by TSMC's leading-edge process technology, meeting the rapidly growing demand for Physical AI," said Sajiv Dalal, President of TSMC North America. "This collaboration underscores our commitment to driving energy-efficient chip innovations that are redefining the future of AI."