Qnity™ and SK hynix Forge Strategic Collaboration to Advance Semiconductor Manufacturing with High-Performance CMP Materials

17 October 2025 | NEWS

Qnity™ and SK hynix Forge Strategic Collaboration to Advance Semiconductor Manufacturing with High-Performance CMP Materials

Strategic Collaboration to Support Advanced Semiconductor Manufacturing with High-Performance Materials

Qnity, DuPont's Electronics business, a premier technology solutions leader across the semiconductor value chain,  announced the signing of a Memorandum of Understanding (MOU) with SK hynix, establishing a strategic long-term agreement for the supply of polishing pads for chemical mechanical planarization (CMP) in semiconductor fabrication.

The agreement supports SK hynix's ongoing needs for advanced CMP pads, used for their next-generation semiconductor manufacturing and mass production processes. It reflects the continuation of a longstanding collaboration in enabling CMP materials for SK hynix's growing memory business.

"This agreement reflects our shared commitment to enabling advancements in the semiconductor and electronics industries through collaboration," said Sanjay Kotha, Global Business Director, CMP Technologies, Qnity™, DuPont Electronics. "We're proud to have a key role in supporting SK hynix's innovation roadmap through our CMP solutions."

The signing ceremony on Tuesday, Oct. 7, was held during SEMICON West in Phoenix, Ariz., and attended by SeongHan Kim, EVP, Head of Procurement, SK hynix; MoonHwan Lee, SVP, Head of Component Procurement & Technology, SK hynix; and Sanjay Kotha, Global Business Director, CMP Technologies, Qnity™, DuPont Electronics.

Qnity is intended to be separated from DuPont on November 1, 2025.* Qnity is a leader in CMP technology, with solutions including leading CMP pad brands like Ikonic™ and IC1000™, CMP slurries, and post-CMP cleans. Qnity recently announced the launch of the Emblem™ CMP pad platform, a next-generation product family designed for the demanding needs of chips for AI and advanced computing, including high-bandwidth memory. Emblem™ pads offer step-out CMP performance and enhanced customization options for emerging CMP process needs.