Aeva Expands Optical Connectivity Portfolio with High-Power Laser and Silicon Photonics Solutions for AI Data Centres

Aeva® (Nasdaq: AEVA), a leader in next-generation sensing and perception systems, introduced an expanded portfolio of solutions within Optical Connectivity, Aeva’s business that leverages proprietary high-power, low noise optical sources and multiwavelength integrated silicon photonics technologies for next-generation AI data centers.

Aeva is engaged with a growing number of optical solutions providers and AI compute companies, driven by our ability to deliver the high-power performance and other requirements needed for next-generation AI data centers, as well as address the significant supply constraints and options in high-power optical sources facing the industry.

"We are building strong momentum in Optical Connectivity with our proven high-power optical source technology and new multiwavelength integrated silicon photonics that meet the performance, efficiency and scalability required for next-generation AI data centers,” said Pradeep Srinivasan, Senior Vice President of Optical Connectivity at Aeva. “By broadening our product portfolio, Aeva is extending its reach across the rapidly growing AI data center market and offering customers greater flexibility in integrating our technology for current and future architectures."

Portfolio of Solutions to Address the Growing AI Data Center Market

Optical Connectivity is built on Aeva’s common high-power optical source technology and designed to deliver the high optical power, high efficiency, low noise, proven reliability, and scalability required to address the rapidly growing bandwidth and power demands of AI data centers. Our solutions range from chipsets and chip arrays to multiwavelength arrays and multichannel modules, which deliver new levels of flexibility for broad AI data center applications including transceivers, NPO, CPO and OCI-MSA. Together, our portfolio enables optical solutions providers, AI compute companies and hyperscalers to more easily integrate Aeva’s solutions.

• Ultra-High Power (UHP) Chipsets: Aeva’s UHP laser delivers high optical power of 350mW or higher at 50°C, narrow linewidth of less than 500kHz and low RIN of less than -150dB/Hz. This addresses a significant gap for high-volume hyperscaler deployments.
• SPECTRA: Proprietary software-defined multiwavelength array delivering precise wavelength control of less than 0.1nm over temperature and operating life. When combined with our UHP SOAs, this silicon photonics integrated array meets the rigorous OCI-MSA specifications across wavelength, optical power and efficiency.
• MESA: Compact Multichannel External Source Assembly (MESA) offering more than 600mW per channel at 50°C with integrated low noise drivers that can be readily assembled into the industry standard External Laser Small Form-factor Pluggable (ELSFP) and NPO form factors.

Proven High-Performance Platform Designed for Scale

Over the past decade, Aeva has developed and industrialized our high-power optical source technology with low noise and narrow linewidth for rigorous automotive and industrial applications. This foundation enables Aeva to bring to the data center market solutions with proven high-performance and demonstrated high-yield and reliability. With limited supply and options of reliable high-power optical sources, Aeva also expands and strengthens the AI infrastructure supply chain with our foundry and manufacturing partners qualified to meet the mass-scale requirements of Aeva's leading automotive and industrial customers.