Marvell Unveils Industry’s First 2nm 64 Gbps Bi-Directional D2D Interconnect for Next-Gen XPUs

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced the industry's first 2nm 64 Gbps bi-directional die-to-die (D2D) interconnect, enabling chip designers to significantly boost the bandwidth and performance of next-generation XPUs while reducing power and silicon area. Delivering 32 Gbps of simultaneous two-way connectivity over a single wire, the interface IP—also available in 3nm—sets a new standard for performance, power efficiency, and resiliency to meet the scaling demands of next-generation data centers.

The Marvell^® 64 Gbps bi-directional D2D interface offers bandwidth density over 30 Tbps/mm, more than three times the bandwidth density of UCIe at equivalent speeds, and a minimal depth configuration that reduces compute die area requirements to 15% compared to conventional implementations. The interface IP is also the industry's first in its class to feature advanced adaptive power management that automatically adjusts device activity to bursty data center traffic. This innovation reduces interface power consumption by up to 75% with normal workloads and up to 42% during peak traffic periods.

The 64 Gbps bi-directional D2D interface IP also enhances performance and reliability with unique features such as redundant lanes and automatic lane repair, which improve yield and reduce bit-error rates by eliminating weak links in the system. Extending beyond the D2D PHY technology, Marvell delivers a complete solution stack—including the application bridge, link layers, and physical interconnect—providing customers with a turnkey platform to reduce time-to-market for next-generation XPUs.

"The 64 Gbps bi-directional D2D interface IP marks an industry first and reflects our commitment to pioneering technologies that enhance performance while reducing total cost of ownership for next-generation AI devices," said Will Chu, senior vice president of Custom Cloud Solutions at Marvell. "By delivering higher bandwidth at lower power, we are enabling customers to scale their architectures to meet the demands of tomorrow's accelerated computing era."