-Tachyum® announced that it is beginning to take steps to defend the use of its registered TPU® trademark. Tachyum initially applied for trademark status in September 2015 and has held the rights to TPU (for its AI Tachyum Processing Unit) since October 2020. Google recently filed for similar trademark protection of Google TPU for its Tensor Processing Unit on November 21st of this ...
United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)(“UMC”), a leading global semiconductor foundry, announced a licensing agreement with imec, a world-leading research and innovation hub in advanced semiconductor technologies, for the transfer of imec’s iSiPP300 silicon photonics process, featuring co-packaged optics (CPO) compatibility, to accelerate UMC’s ...
Uniting Global Semiconductor Leaders to Drive Industry Innovation and Growth The Hong Kong University of Science and Technology (HKUST) and SEMI successfully concluded the inaugural 2025 Semiconductor Innovation and Intelligent Application Summit (SIIAS). As a prelude to the University's 35th anniversary celebrations and supported by the HKSAR Government, the landmark event makes its debu...
Multi-year collaboration spans NVIDIA CUDA accelerated computing, agentic and physical AI, and Omniverse digital twins to achieve simulation speed and scale previously unattainable through traditional CPU computing – opening new market opportunities across engineering. To further adoption of GPU-accelerated engineering solutions, the companies will collaborate in engineering and marketi...
Fujifilm has announced the completion of a new state-of-the-art building at its Shizuoka site in Japan, marking a significant expansion of its semiconductor materials operations. The facility is designed to strengthen the company’s research, development and quality-evaluation capabilities as global demand for sophisticated chipmaking materials continues to rise. Situated within the Fujifi...
Record net sales of $267.0 million, representing 13% year-over-year growth GAAP gross margin of 51.9%, up from 51.1% a year ago and Non-GAAP adjusted gross margin of 53.0%, up from 52.4% a year ago GAAP operating margin of 11.6% compared to 7.5% a year ago and Non-GAAP adjusted operating margin of 20.6% compared to 18.3% a year ago GAAP diluted loss per share of $0.03 compared to a diluted ...
W. L. Gore & Associates announced the opening of its Battery Lab in Shanghai, China, expanding its global R&D capabilities to accelerate advanced battery materials development for customers worldwide. The lab is dedicated to the development, characterization, and rigorous testing of critical materials for battery cells and packs—spanning membranes, venting solutions, moisture and con...
Proposed all-stock transaction aims to align JEV's scalable energy platform with Smartkem's semiconductor innovations to power next generation AI data centers Smartkem, Inc. (Nasdaq: SMTK), ("Smartkem"), a company developing a new class of organic semiconductor technology, announced that it has agreed to a 60-day extension of its non-binding Letter of Intent ("LOI") for a proposed all-stock bus...
Hands-on courses will be powered by Pulsar microcontrollers across universities and professional programs Innatera, the leader in brain-like neuromorphic computing for ultra-low-power intelligence at the sensor edge, announces its supply-led collaboration with VLSI EXPERT, a leading semiconductor training, skilling, and up-skilling organization in India and the United States. The agreement b...
Strategic Collaboration Uses Sivers' TRB02801 Integrated Circuit to Power Tachyon's Innovative Millimeter-Wave Solution Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, announced a mass-production purchase order agreement valued at approximately $3 million with Tachyon Networks Inc. ("Tachyon"), a pioneering provider of affordab...
New platform delivers ALD film quality at production throughput for Wide Bandgap and other specialty device manufacturing Beneq, a global leader in Atomic Layer Deposition (ALD) equipment and solutions, announced Beneq Transmute™, a next-generation ALD platform designed for high-volume semiconductor manufacturing. Engineered for high volume production of Wide Bandgap (WBG) power electronics...
dSPACE will demonstrate a new radar solution for functional testing of radar sensors. The DARTS ARROWhas been specially developed for use in end-of-line tests and periodic technical inspections (PTI) of radar-based driver assistance systems. The compact radar target simulator is efficient and easy to use and simulates the range, speed, and radar target cross-section of a radar target in dynamic ...
Acquisition strengthens Onto’s position in advanced materials characterization for advanced logic/memory, specialty and advanced packaging segments Onto Innovation Inc. announced the successful closing of its previously announced acquisition of key product lines from the materials analysis business of Semilab International. Valued at approximately $495 million, the transaction ...
New program comes in response to surging demand for CoreWeave’s purpose-built AI cloud, saving customers more than a million dollars for typical data migrations CoreWeave, Inc. (Nasdaq: CRWV), The Essential Cloud for AI™, announced the launch of its Zero Egress Migration (0EM) program — a true no-egress-fee data migration program — enabling customers to mov...
Taiyo Holdings Co., Ltd. (Securities Code: 4626; hereinafter referred to as "Taiyo Holdings"), based in Tokyo, presented a paper, co-authored with imec, one of the world's largest semiconductor research institutions, at the 14th IEEE CPMT Symposium Japan (ICSJ2025), focusing on the "FPIM (TM) Series" (hereinafter referred to as "this material"), a negative-type photosensitive insula...
New Framework outlines OIF’s vision for 448 Gbps interconnects, setting the stage for future Implementation Agreements that will power AI, HPC and communications systems OIF convened its Q4 2025 Technical and MA&E Committees Meeting in Busan, South Korea, Nov. 3–7, where global members gathered to advance the organization’s work across optical, electrical, manage...
Wolfspeed, Inc. (NYSE: WOLF), a global leader in innovative silicon carbide power solutions, announced a collaboration with Hopewind, a global innovator in renewable energy solutions. Together, the two companies will advance the development of the next generation of wind power solutions by integrating Wolfspeed’s cutting-edge 2.3kV LM Pack Module into Hopewind’s advanced highly modul...
Three new endoscopes set to launch, including an innovative laparoscope, a 3D imaging solution for robotic surgeries, and the first single-use colonoscope with 4K video resolution Valens Semiconductor announced that the first endoscopes powered by its VA7000 chipset will be launched by three OEMs, signaling strong momentum for Valens' entry into the medical imaging market. The products in...
-Cornelis, a leading provider of intelligent, high-performance networking solutions, announced the successful qualification and integration of its CN5000 Omni-Path® networking solution across Lenovo’s ThinkSystem V3 and V4 servers. The CN5000 is now a fully supported networking fabric in Lenovo’s EveryScale Solution, empowering customers to deploy tightly integrated, high-perform...
Okika Devices announced the launch of its new Chameleon™ product family — a tiny yet powerful analog module that adapts to a wide range of analog design needs. Each Chameleon™ module integrates an Okika Field Programmable Analog Array (FPAA) with on-module nonvolatile memory, a precision oscillator, and reconfiguration circuitry — delivering pre-programmed, ready-to...