ShunYun Technology Ltd (SYT), a world-class manufacturer of optical transceivers, and NewPhotonics, a leading designer of highly integrated photonic integrated circuit (PIC) chips for data center optical interconnect, today announced a strategic OSAT partnership for volume manufacturing of the NewPhotonics NPG product line. Ethernet pluggable optics are forecasted to scale to >100 million by...
Taking place from October 28 to 30, 2025 at the Shenzhen World Exhibition & Convention Center (Bao'an), NEPCON ASIA is the premier platform to discover the latest technologies and market trends, connect with new suppliers and products, and explore potential partnerships and distribution opportunities. Featuring an ever-expanding showcase of automation equipment and technologies, the ...
Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automobile SoCs, announced the immediate availability of its Total IP for eUSB with the eUSB v2 Controller and eUSB v2 PHY IP. Arasan's eUSB2 has been designed to target SoCs operating at 1.2V as the interface operating voltage. Arasan is one of the pioneers in the USB IP business having started with USB 1.0 as the compan...
Senior engineers, company leaders, investors, researchers and students of microelectronics are to have a new opportunity to meet, discover and learn with the launch of the Microelectronics UK exhibition, to be held on 24-25 September 2025 at the Excel London. The event, the first in the UK to bring together the entire microelectronics value chain, will feature zones and content for semiconducto...
SK keyfoundry, an 8-inch pure-play foundry in Korea, announced that it has successfully co-developed core technology and completed reliability testing of Direct RDL (Redistribution Layer) – a core semiconductor packaging technology based on 8-inch wafers – in collaboration with LB Semicon. This achievement marks a significant step forward in advancing next-generation semiconductor pa...
InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced design for TSMC's Face-to-Face (F2F) SoIC technology, fully compliant with the UCIE 2.0 (Universal Chiplet Interconnect Express) standard. This milestone marks a significant achievement in enabling high-speed interconnects for heterogene...
Tekscend Photomask (formerly Toppan Photomask), the world's largest merchant photomask supplier for the semiconductor industry, has installed a state-of-the-art photomask laser writing system, the SLX1, at its Corbeil, France facility. This marks the first European deployment of the SLX1 system, manufactured by Swedish technology leader, Mycronic AB. The new system represents a strat...
The SEMI Foundation is thrilled to announce the launch of the application process for organizations seeking to become Regional Nodes in the National Network for Microelectronics Education (NNME), a nationwide initiative funded by the U.S. National Science Foundation and supported by the U.S. Department of Commerce that aims to advance education, training, and employment pathways in the U.S. micr...
Flip Electronics, an authorized distributor of obsolete semiconductors and electronic components, announced that it is rebranding its subsidiary, Resurgent Manufacturing Services, to Flip Electronics Manufacturing Services (FMS). In January 2023, Flip Electronics acquired Resurgent Semiconductor, expanding its obsolescence management portfolio with extended-life manufacturing services for obsol...
Frost & Sullivan is pleased to announce that Baya Systems has been recognized with the 2025 Global Technology Innovation Leadership Recognition in the semiconductor IP interconnect solutions industry for its outstanding achievements in product innovation, strategic execution, and customer impact. This recognition highlights Baya Systems' consistent leadership in driving measurable ...
GS Microelectronics US, Inc. (GSME), the fastest-growing semiconductor service provider from North America, announced the acquisition of Sinble Technology Vietnam Company Limited, a strategic move to enhance its design expertise in TSMC-based advanced process nodes. "This acquisition aligns seamlessly with our strategic growth roadmap," - Farhat Jahangir, President and CEO of GSME The acquisitio...
MetaOptics Ltd (the "Company", together with its subsidiary, the "Group") is a cutting-edge semiconductor optics company pioneering glass-based metalenses with AI-enhanced imaging. The Group is a vertically integrated frontrunner in metalens technology headquartered in Singapore, and has lodged its preliminary offer document for its upcoming initial public offering (the "IPO") on the Catali...
iDEAL Semiconductor, a fabless power semiconductor company focused on delivering breakthrough efficiencies, has announced it will partner with Power and RF specialist, Richardson Electronics. Under the agreement, iDEAL will gain access to Richardson Electronics' design teams and sales specialists to expand the reach of its ultra-efficient, high-performance power MOSFETs, which are based o...
Quantum Computing Inc. ("QCi" or the "Company"), an innovative, integrated photonics and quantum optics technology company, announced it has been awarded a contract by the National Institute of Standards and Technology (NIST), part of the U.S. Department of Commerce, for the design and fabrication of thin-film lithium niobate (TFLN) photonic integrated circuits (PICs). In addition, the Comp...
NEO Semiconductor, a leading developer of breakthrough memory technologies, introduced the world's first Extreme High Bandwidth Memory (X-HBM) architecture for AI chips. Built to meet the growing demands of generative AI and high-performance computing, X-HBM delivers unmatched performance with a 32K-bit data bus and potentially 512 Gbit per die, dramatically surpassing the limitations of tra...
In a world increasingly shaped by intelligent devices that connect, sense, and perceive our surroundings, Ceva, Inc., the leading licensor of silicon and software IP for the Smart Edge, today announced it has surpassed 20 billion Ceva-powered devices shipped globally. This milestone not only cements Ceva's legacy as a foundational technology provider of the mobile and IoT eras, but sets the...
Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automobile SoCs, announced the immediate availability of the industry's first MIPI SWI3S Manager IP and SWI3S Peripheral IP Cores. The SWI3S IP gate count is kept extremely low, targeting applications like the Microphones while also ensuring low latency. Arasan's SWI3S IP joins Arasan's extensive MIPI IP portfolio ...
Cyient Semiconductors Private Limited, a fast-growing custom silicon company, announced a strategic Channel Partner Agreement with GlobalFoundries (GF), one of the world's leading pure-play semiconductor foundries. Under the agreement, Cyient Semiconductors becomes an authorized reseller of GF's semiconductor manufacturing services and technologies. This collaboration is a significant step towa...
Axcelis Technologies, Inc., a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced a Joint Development Program (JDP) with GE Aerospace focused on the development of production-worthy 6.5 to 10kV superjunction power devices. Processes will be developed on Axcelis' Purion XEmax™ high energy implanter, which provides the industry's highest beam cur...
Pixelworks, Inc., a leading provider of visual processing solutions, announced that the newly launched realme P4 5G and P4 Pro 5G smartphones incorporate Pixelworks' X7 Gen 2 visual processor. The realme P4 series smartphones are the first models in the P series to integrate a dedicated visual processor solution aimed at setting a new benchmark for mid-range international market segment. Powered...