• Tuesday | 12 May 2026
FPT Corporation and Intel Corporation Partner to Accelerate AI-Driven Factory Optimisation

FPT and Intel, a global leader in semiconductor and AI technologies, announced a strategic relationship to deliver an end-to-end AI-driven factory optimisation solution. Powered by AI, simulation, and digital manufacturing technologies, the collaboration aims to reduce bottlenecks, accelerate decision-making and improve downtime recovery, facilitating the sector’s transition towards AI-drive...

29 Apr 2026 | Wednesday | NEWS
Kyocera Corporation Launches Ceramic Core Substrate for Next-Generation AI Semiconductor Packaging

Kyocera Corporation (President: Shiro Sakushima; “Kyocera”) announced that it is commercialising a new multilayer ceramic core substrate for advanced semiconductor packages, such as xPUs(1) and switch ASICs, which are rapidly scaling in complexity as AI data centre architectures evolve. The new product will be unveiled at ECTC 2026, an international conference ...

29 Apr 2026 | Wednesday | NEWS
OKI Circuit Technology Develops 180-Layer PCB Technology for Next-Generation AI and HBM Testing

OKI Circuit Technology (OTC; President: Masaya Suzuki; Head office: Tsuruoka City, Yamagata), the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) (Note 1) mounted on AI semiconductors. This represents an approximat...

29 Apr 2026 | Wednesday | NEWS
Kingston Digital, Inc. Expands DC3000ME Gen5 SSD Line with New 30.72TB Enterprise Model

Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, announced the launch of the Kingston DC3000ME Gen5 U.2 NVMe SSD with a new high-capacity 30.72TB1 option, expanding the DC3000ME family to address the growing storage density and performance demands of modern data centres. The DC3...

28 Apr 2026 | Tuesday | NEWS
Seoul Viosys Accelerates Expansion into Next-Generation Photonics and Optical Interconnects

Seoul Viosys (KOSDAQ: 092190), a company specialising in opto-semiconductor devices, is accelerating its entry into the next-generation photonics market supported by its proprietary “No-wire” and “No-package” fundamental patents—essential technologies for micrometre (μm)-scale miniaturisation of opto-semiconductors—as well as its competitiveness in VCSEL...

28 Apr 2026 | Tuesday | NEWS
Palliser Capital Urges SMC Corporation to Unlock Shareholder Value Through ¥600 Billion Buyback

Palliser Capital (“Palliser”), a top 25 shareholder of SMC Corporation (“SMC” or the “Company”),  published a comprehensive plan (“Value Enhancement Plan”) outlining the opportunities available to unlock substantial long-term value at the Company. To promote market transparency and respond to growing interest from shareholders and other stakeho...

28 Apr 2026 | Tuesday | NEWS
Trio-Tech International Announces $10 Million Registered Direct Offering

Trio-Tech International (“Trio-Tech” or the “Company”) (NYSE MKT: TRT), a comprehensive provider of semiconductor back-end solutions and a global value-added supplier of electronic equipment, announced that it has entered into securities purchase agreements with fundamental institutional investors for the purchase and sale of 1,052,632 shares of its common stock in a regist...

28 Apr 2026 | Tuesday | NEWS
Omdia Raises 2026 Semiconductor Revenue Forecast on Surging Memory Demand

Omdia has significantly raised its semiconductor revenue forecast for 2026 to 62.7%, again reflecting unprecedented growth in DRAM and NAND driven by sustained demand and ongoing supply shortages expected to persist through the year. The DRAM market is forecast to nearly double in value, while the smaller NAND segment could quadruple compared to 2025. Supply constraints in conventional memory IC ...

28 Apr 2026 | Tuesday | NEWS
Marvell Technology, Inc. Acquires Polariton to Advance Next-Generation Optical Connectivity

Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, announced the acquisition of Polariton Technologies, a developer of high-speed, low-power plasmonics-based silicon photonics devices. The acquisition strengthens Marvell’s optical technology portfolio by adding advanced modulation capabilities that enable continued scaling in bandwidth, power ef...

28 Apr 2026 | Tuesday | NEWS
Taiwan Semiconductor Manufacturing Company Unveils A13 Process to Advance AI, HPC and Next-Generation Semiconductor Innovation

TSMC (TWSE: 2330, NYSE: TSM) debuted its latest innovation in its most advanced process technology at the Company’s 2026 North America Technology Symposium. TSMC’s new A13 process is a direct shrink of its industry-leading A14 node announced in 2025, enabling even more compact and efficient designs to address insatiable customer demand in computational requirements for next-generation ...

27 Apr 2026 | Monday | NEWS
JEDEC Solid State Technology Association Previews Next-Generation LPDDR6 Enhancements for AI and Data Centre Workloads

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, previewed a set of new features planned for incorporation into the next version of its JESD209‑6 LPDDR6 standard. Building on the foundational JESD209‑6 published in July 2025, JEDEC’s JC‑42.6 Subcommittee has been working to enhance the next version of th...

27 Apr 2026 | Monday | NEWS
Wolfspeed, Inc. Appoints Yasuhisa Harita as Asia Pacific Regional President

Wolfspeed, Inc. announced the appointment of Yasuhisa Harita as regional president for Asia Pacific. Harita will be based in Tokyo and lead Wolfspeed’s commercial strategy across Japan, Korea and the ASEAN region with responsibility for driving revenue growth, enhancing strategic customer relationships, and executing the company’s regional commercial and operational objectives. Harita...

27 Apr 2026 | Monday | NEWS
GigaDevice Launches GD32F5HC Microcontroller Series for HMI and IoT Edge Applications

GigaDevice, a leading global supplier of semiconductor devices, announced the official launch of the GD32F5HC series 32‑bit general‑purpose microcontrollers. Designed with compact size, high frequency operation, large memory, and strong security, while also offering ultra‑low power consumption and rich peripheral configuration, the new series expands the GD32 Arm® Cortex®â€...

27 Apr 2026 | Monday | NEWS
SK hynix Inc. Wins IEEE Corporate Innovation Award for Leadership in AI Memory

SK hynix Inc. (or "the company", www.skhynix.com) announced that it received the Corporate Innovation Award at the '2026 IEEE1 Honours Ceremony' held in New York on the 24th (local time). IEEE is the world's largest technical professional organisation dedicated to advancing technology for the benefit of humanity. Established more than a century ago, the IEEE Awards Program recognises in...

27 Apr 2026 | Monday | NEWS
Arasan Launches UFS 5.0 Host Controller IP for High-Performance Mobile and Edge AI Applications

Arasan extends its long history of support for JEDEC and MIPI standards with the immediate availability of UFS 5.0 Host controller IP. Arasan's UFS 5.0 Host Controller IP supports a maximum throughput of 46.694 Gbps with M-PHY HS-Gear 6 operation, providing very high data transfer rates with low power consumption for advanced mobile applications such as high-end smartphones and edge AI devices. A...

27 Apr 2026 | Monday | NEWS
NEO Semiconductor Validates 3D X-DRAM as Scalable Path for AI Memory

NEO Semiconductor, a leading innovator in advanced AI and memory technologies, announced successful proof-of-concept (POC) results for its 3D X-DRAM™ technology, marking a major milestone toward next-generation, high-density memory solutions for AI and data-centric systems. The company also announced a new strategic investment led by Stan Shih, Founder and former Chairman and CEO of Ac...

24 Apr 2026 | Friday | NEWS
MetaOptics Ltd Secures Design Wins and Advances Commercialisation of Metalens Technology

MetaOptics Ltd (Catalist: 9MT) ("MetaOptics" or the "Company", and together with its subsidiaries, the "Group") is pleased to announce that it has achieved a progressive milestone in securing design/evaluation orders of its metalenses and modules from world-class customers. As announced in the Company's annual report for the financial year ended 31 December 2025, the Company noted that custo...

24 Apr 2026 | Friday | NEWS
Synopsys Expands Collaboration with TSMC to Advance AI Chip Design

Synopsys, Inc. (Nasdaq: SNPS) announced major advances in silicon-proven IP, AI-powered EDA flows, and system-level enablement across TSMC's most advanced processes and packaging technology nodes, including the TSMC 3nm and 2nm families, as well as A16™ with Super Power Rail and A14. By unifying intelligent digital, analogue, and verification flows, advanced 3D multi-die design, a...

24 Apr 2026 | Friday | NEWS
Flex and Teradyne Robotics Expand Partnership to Scale Intelligent Automation

Flex (NASDAQ: FLEX) and Teradyne Robotics are expanding their collaboration to accelerate intelligent automation across global manufacturing. Under the expanded relationship, Flex plays a dual role by deploying Teradyne Robotics solutions within its own production facilities while manufacturing key robotics components that enable scalable automation deployments for Teradyne Robotics customers...

24 Apr 2026 | Friday | NEWS
MetOx International Appoints Semiconductor Veteran Richard (Rick) Gottscho to Board

MetOx International — MetOx, a leading U.S. manufacturer of high-temperature superconducting (HTS) wire, announced the appointment of Dr. Richard (Rick) Gottscho to its Board of Directors. A globally recognised leader in semiconductor manufacturing and plasma science, Rick brings decades of experience scaling the technologies that underpin the modern digital economy. His addition comes...

24 Apr 2026 | Friday | NEWS

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