• Tuesday | 29 September 2026
Hanmi Semiconductor Ships First FC Bonder 75 to Expand AI Advanced Packaging Portfolio

South Korean semiconductor equipment manufacturer Hanmi Semiconductor has shipped its first FC Bonder 75 system to a global customer, marking a move into advanced packaging equipment for AI system semiconductors. The company has traditionally been known for its thermal compression (TC) bonding equipment used in high-bandwidth memory (HBM) production, while the new system broadens its focus towards...

29 Sep 2026 | Tuesday | NEWS
Fraunhofer IAF Develops 420GHz Broadband MMIC for AI Datacentres and High-Resolution Radar

Fraunhofer Institute for Applied Solid State Physics IAF in Freiburg, Germany, has developed a new broadband distributed amplifier monolithic microwave integrated circuit (MMIC) designed for applications including data centres, precision measurement equipment and high-resolution radar sensors. The new amplifier is intended to meet the growing requirement for devices that can deliver very wide band...

29 Sep 2026 | Tuesday | NEWS
Wise Integration and Navitas Partner to Advance GaN and SiC Power Solutions for AI Datacentres

Wise Integration has announced a collaboration with Navitas Semiconductor to develop next-generation power-conversion solutions aimed at supporting the rapidly growing power requirements of artificial intelligence and high-performance computing systems. Under the collaboration, the two companies will combine Wise Integration’s digital power-control capabilities with Navitas Semiconductor&rsq...

29 Sep 2026 | Tuesday | NEWS
Synopsys Launches AgentEngineer Portfolio to Advance Autonomous Silicon-to-Systems Engineering

Synopsys, Inc. (Nasdaq: SNPS) announced Synopsys AgentEngineer™ solutions, the industry's broadest portfolio of domain-specific long-horizon agents that can reason, plan, and execute complete engineering workflows from silicon to systems across verification, system validation, implementation, analog, manufacturing, and simulation and analysis domains. Built on the Synopsys Autopilo...

29 Sep 2026 | Tuesday | NEWS
Wolfspeed Launches Premium 200 mm SiC Substrate to Improve Device Manufacturing Yield

Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide (SiC) technology, announced the commercial availability of its new Premium 200 mm n-type silicon carbide substrate, expanding its 200 mm SiC materials portfolio with a higher-quality starting material designed to improve yield through reduced defects and greater wafer-shape stability. As the SiC devices industry pushes toward higher...

29 Sep 2026 | Tuesday | NEWS
POLYN Advances VibroSense TMS Chip for Real-Time Tyre-Road Friction Detection

POLYN Technology, developer of innovative application-specific neuromorphic analogue signal-processing (NASP™) chips, announced a major milestone in the rollout of its VibroSense TMS solution, which tests have already shown enhances vehicle safety through improved braking. The VibroSense TMS engineering chip, the integrated circuit for tire-road friction detection, is being delivered for as...

29 Sep 2026 | Tuesday | NEWS
Shanghai Chengwei Launches High-Purity Chemical Delivery Systems for Advanced Manufacturing

Shanghai Chengwei Semiconductor Equipment has announced the global commercial launch of new high-purity chemical delivery and bulk chemical distribution systems designed for advanced semiconductor manufacturing. The company said the systems are intended to support stringent contamination-control requirements in semiconductor fabs, as well as flat-panel display and photovoltaic production facilitie...

28 Sep 2026 | Monday | NEWS
Tower Semiconductor Plans US$3 Billion Japan Expansion for Silicon Photonics and Optical Packaging

  Tower Semiconductor is set to invest up to US$3 billion in expanding its semiconductor manufacturing operations in Japan, with additional government support taking the total investment to around US$4 billion. The expansion is aimed at creating a large-scale manufacturing hub for silicon photonics, silicon-germanium electronic integrated circuits and advanced optical packaging. ...

28 Sep 2026 | Monday | NEWS
Singapore Launches SG Semiconductor Initiative to Expand Advanced R&D and Manufacturing

Singapore has introduced a new national initiative, SG Semiconductor, to strengthen the global profile of its semiconductor industry and attract further investment in advanced research and manufacturing. Developed by the Agency for Science, Technology and Research (A*STAR) and the Economic Development Board (EDB), the initiative will present Singapore’s semiconductor research, manufacturing ...

28 Sep 2026 | Monday | NEWS
Gigaphoton Installs KrF Excimer Laser to Advance High-Temperature Superconducting Wire Manufacturing

Gigaphoton Inc. (Head Office: Oyama, Tochigi; President and CEO: Tatsuo Enami), a manufacturer of lightsources for leading-edge semiconductor fabrication processes, announced that it has installed its L300KZ KrF excimer laser for pulsed laser deposition (PLD) at a domestic manufacturer of high-temperature superconducting wire on September 25, 2026. Developed under Goal 10 of Japan’s Moonshot...

28 Sep 2026 | Monday | NEWS
Renesas Launches Smallest GreenPAK Device to Enable More Compact Consumer Electronics

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced the SLG46801, the industry’s smallest GreenPAK configurable mixed-signal device offered in both WLCSP and STQFN packages. The 9-ball WLCSP measures just 1.155 mm × 1.155 mm and combines an ultra-small footprint with multi-time programmability to enable designers to reduce board...

28 Sep 2026 | Monday | NEWS
ACCM Expands US Manufacturing Capacity for Celeritas Materials Supporting AI Hardware

Advanced Chip and Circuit Materials, Inc. (ACCM) announced a major expansion of its US manufacturing capacity for the Celeritas® family of advanced dielectric materials, covering the four segments of AI hardware where material supply and performance currently constrain system design: ultra-high-speed skew-free materials, low- and negative-expansion laminates for large accelerator boards, IC su...

28 Sep 2026 | Monday | NEWS
Shanghai Chengwei Semiconductor Equipment Launches Central Gas Supply System for Advanced Laboratories

Shanghai Chengwei Semiconductor Equipment Co., Ltd. has officially announced the launch of its latest laboratory central gas supply system. This high-purity engineering infrastructure solution is designed to meet the rigorous gas delivery demands of modern semiconductor research and development facilities, advanced university laboratories, and precision testing centres. By consolidating multiple s...

25 Sep 2026 | Friday | NEWS
Toshiba Launches 3300V 800A SiC MOSFET Module for High-Efficiency Industrial Power Systems

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has expanded its lineup with the launch of “IX800FXF2YMS4,” a dual SiC MOSFET module for industrial equipment, including railway vehicles, renewable energy power generation systems and power conversion systems. The new module features Toshiba’s third-generation silicon carbide (SiC) MOSFET chips, a drain...

25 Sep 2026 | Friday | NEWS
REX Shares Launches CHIP ETF to Capture Global AI Chipmaking Equipment Growth

REX Shares (“REX”), a leading innovator in alternative ETFs, announced the launch of the REX AI Chipmaking ETF (Ticker: CHIP), a thematic ETF built to own the equipment layer of the Artificial Intelligence buildout. CHIP holds the companies that make the tools each AI chip has to pass through: wafer fabrication equipment, advanced packaging, and metrology, rather than the chip designer...

25 Sep 2026 | Friday | NEWS
Cadence and TSMC Expand AI and HPC Design Collaboration Across Advanced Nodes and 3D-IC

Cadence (Nasdaq: CDNS) announced an expanded partnership with TSMC to deliver advanced capabilities for AI and HPC designers. Cadence has achieved tool certification for TSMC’s advanced A14 process, demonstrated an industry-leading UALink solution in TSMC N3P, and introduced new silicon-proven IP for N3P and N2P technologies. Through this partnership, the companies are enabling agentic AI ch...

25 Sep 2026 | Friday | NEWS
EdgeCortix Unveils RAIDEN Chiplet Platform to Scale High-Performance Physical AI

Physical AI has a system problem. Machines that perceive, reason and act in the real world cannot scale by adding AI accelerators alone. Compute, memory capacity, memory bandwidth, connectivity, and software must scale together and continue scaling as the AI models and application workloads evolve. EdgeCortix®, a leading Japanese fabless semiconductor company specialising in energy-effici...

25 Sep 2026 | Friday | NEWS
Synopsys and TSMC Expand AI Chip Design Collaboration with Agentic AI and Advanced Packaging

Synopsys (Nasdaq: SNPS) announced innovations with TSMC that accelerate the development of next-generation AI, high-performance computing (HPC), and advanced semiconductor systems. Through AI-powered EDA flows, multiphysics-aware signoff methodologies, multi-die design flows, and silicon-proven Interface and Foundation IP, Synopsys and TSMC are helping customers address growing design complex...

25 Sep 2026 | Friday | NEWS
Cognex Launches In-Sight 1750 for AI-Driven Wafer Traceability and Semiconductor Production

Cognex Corporation (NASDAQ: CGNX), the global technology leader in industrial machine vision, announced the launch of the In-Sight® 1750 Series, a next-generation wafer and panel identification system designed to help semiconductor manufacturers reduce disruptions, improve traceability, and maintain throughput. As semiconductor manufacturers expand capacity to support AI infrastructure, advan...

24 Sep 2026 | Thursday | NEWS
IonQ and SDT Strengthen South Korea Quantum Ecosystem with Superion 256 Partnership

IonQ (NYSE: IONQ), the world’s leading full-stack quantum platform and foundry, announced a strategic partnership with Korea-based quantum technology and software company SDT, Inc. Under this multi-year collaboration, IonQ will supply SDT with a Superion 256 quantum computer as well as IonQ’s silicon-vacancy (SiV) quantum memory module. "Demand for our new Superion 256 system is growi...

24 Sep 2026 | Thursday | NEWS

Asia Pacific

Europe

United States of America