• Tuesday | 12 May 2026
Longsys Showcases Artificial Intelligence Driven Semiconductor Storage Solutions at Embedded World 2026

At Embedded World 2026, branded semiconductor memory enterprise Longsys (301308.SZ) demonstrated its integrated storage innovation capabilities and dual business-model value under the theme "AI Storage for Embedded World". Automotive-grade Portfolio Powers Intelligent Vehicles With seven years of expertise in automotive-grade storage, Longsys has built comprehensive capabilities across chi...

19 Mar 2026 | Thursday | NEWS
Siemens Launches Autonomous Artificial Intelligence Agent for Semiconductor Design Automation

Siemens announced the Fuse™ EDA AI Agent system, a purpose-built domain-scoped autonomous AI agent that plans and orchestrates multi-tool and multi-agent complex semiconductor, 3D IC and printed circuit board (PCB) system workflows that span across design, verification and manufacturing sign-off. Supporting NVIDIA Agent Toolkit, advanced Nemotron models and NVIDIA AI infrastructure, the Fuse...

19 Mar 2026 | Thursday | NEWS
E&R Engineering Corp. Expands North America Footprint with New Semiconductor Hub in Portland

Semiconductor equipment supplier E&R Engineering Corp. (8027.TW) announced its new office in Hillsboro, Portland. Following the establishment of its Phoenix, Arizona site, this second North American hub marks a milestone in providing localized support within the U.S. semiconductor ecosystem. Closer to Key Customers, with Order Visibility Extending to 2027 Driven by surging de...

19 Mar 2026 | Thursday | NEWS
Innatera and Joya Design Bring Neuromorphic Semiconductor Technology to Consumer Audio

Innatera, a specialist in neuromorphic computing for ultra-low-power edge AI, has partnered with Joya Design to deliver a commercially viable consumer audio solution powered by its Pulsar chip. The collaboration marks a significant step in transitioning brain-inspired computing from development into real-world product deployment. Joya Design has successfully integrated Innatera’s Pulsar mic...

19 Mar 2026 | Thursday | NEWS
Kinaxis Inc. Accelerates Semiconductor Supply Chain Optimisation with Artificial Intelligence Computing

Kinaxis® Inc. (TSX: KXS), a global leader in supply chain orchestration, announced a new milestone in advancing large-scale supply chain optimisation within the Kinaxis Maestro™ platform. Maestro already delivers high-performance optimisation across complex global supply chains, and Kinaxis is now extending that leadership by leveraging GPU acceleration powered by NVIDIA cuOpt&...

19 Mar 2026 | Thursday | NEWS
Sivers Semiconductors AB Partners with O-Net Technologies and Enablence Technologies Inc. on Optical Interconnect Solution for Artificial Intelligence Data Centres

Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, announced a strategic partnership with O-Net Technologies and Enablence Technologies Inc. (TSXV: ENA) to develop an advanced external light source (ELS) module with Sivers laser arrays to support Co-Packaged Optics (CPO) roll-out in AI datacenters and HPC systems. O-Net ...

19 Mar 2026 | Thursday | NEWS
Sony Semiconductor Solutions Corporation Launches 4K Image Sensor with Advanced LOFIC Pixel Technology

Sony Semiconductor Solutions Corporation (Sony) today announced the upcoming launch of the IMX908, a 4K CMOS image sensor for security cameras featuring the industry's smallest 1.45 µm LOFIC pixels. * The new sensor utilises newly developed LOFIC pixels to achieve 96dB high dynamic range images with a single exposure at 4K resolution. This results in improved low-light performance...

18 Mar 2026 | Wednesday | NEWS
Synopsys Showcases Artificial Intelligence Driven Semiconductor Design Collaboration with NVIDIA

At GTC 2026, Synopsys presented the outcomes of its ongoing collaboration with NVIDIA, highlighting how the integration of AI and accelerated computing is reshaping modern engineering and design processes. By combining its expertise in electronic design automation (EDA) and simulation with NVIDIA’s high-performance computing technologies, Synopsys is enabling organisations to tackle increas...

18 Mar 2026 | Wednesday | NEWS
Tower Semiconductor and Oriole Networks Partner to Advance Optical Switching for Artificial Intelligence Infrastructure

Tower Semiconductor has announced a strategic collaboration with Oriole Networks to accelerate the development of next-generation AI infrastructure, leveraging nanosecond optical circuit switching technology. The partnership brings together Oriole’s advanced networking architecture with Tower’s high-volume silicon photonics manufacturing platform. The objective is to commercialise opt...

18 Mar 2026 | Wednesday | NEWS
Wolfspeed, Inc. Positions 300 MM Silicon Carbide Platform for Artificial Intelligence and High Performance Computing

Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, announced that its 300mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler for advanced AI and high‑performance computing (HPC) heterogeneous packaging by the end of this decade. “As AI workloads continue to increase package size, power density, and integration complexity, ...

18 Mar 2026 | Wednesday | NEWS
Marvell Technology and Mojo Vision Partner on Micro-LED Optical Interconnects for AI Data Centres

Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, and Mojo Vision, the high-performance micro-LED platform company, announced a long-term collaboration to develop a new class of optical interconnect solutions to power the next wave of high-performance AI data center infrastructure. Today’s rapidly growing AI workloads are beginning to str...

17 Mar 2026 | Tuesday | NEWS
Manz Asia and Seiko Epson Corporation Partner to Advance Inkjet Technology in Semiconductor Manufacturing

 A leading semiconductor advanced packaging equipment manufacturer, Manz Asia, announced a strategic partnership with Seiko Epson Corporation (Epson) aimed at accelerating the adoption of advanced inkjet technology in semiconductor manufacturing.  The collaboration combines Manz Asia's expertise in semiconductor equipment engineering, process integration, and intelligent software with E...

13 Mar 2026 | Friday | NEWS
Nordic Semiconductor Launches Fuel Gauge v2.0 for IoT Battery Management

Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, announces Nordic Fuel Gauge v2.0, a major upgrade of its highly accurate software-based fuel gauge solution for the award-winning nPM1300 and nPM1304 Power Management ICS, at Embedded World 2026. The release adds sophisticated State-of-Health estimation, adaptive battery modelling, and long-term fleet analytics cap...

12 Mar 2026 | Thursday | NEWS
Everspin Technologies Launches UNISYST MRAM Unified Memory Platform

Everspin Technologies, Inc. (NASDAQ: MRAM), the world’s leading developer and manufacturer of magnetoresistive random access memory (MRAM) persistent memory solutions, announced the UNISYST MRAM family, a new generation of unified memory designed to fundamentally change how embedded systems store and access code and data. “System designers are running into the physical and p...

11 Mar 2026 | Wednesday | NEWS
Semtech Corporation, Digital Barriers Partner on AI Video Compression for Cellular Surveillance

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced a partnership with Digital Barriers to deliver a fully integrated device-to-cloud cellular video solution, Semtech Video Compression, purpose-built for critical video surveillance and analytics. The turnkey solution int...

11 Mar 2026 | Wednesday | NEWS
India Advances Semiconductor Talent Pipeline Under Chips to Startups Programme

India has made considerable progress towards its goal of training 85,000 semiconductor engineers through the Chips to Startups (C2S) Programme, an initiative launched by the Government of India as part of the India Semiconductor Mission. The programme focuses on developing talent by providing training, upskilling opportunities and workforce development to strengthen the country’s semiconduc...

10 Mar 2026 | Tuesday | NEWS
LG Uplus Partners with FuriosaAI to Develop Semiconductor-Powered Sovereign AI Appliance

LG Uplus has entered into a partnership with AI semiconductor firm FuriosaAI to jointly develop an enterprise-focused “sovereign AI appliance” designed for secure, on-premises deployment. The companies signed a memorandum of understanding for AI infrastructure cooperation during Mobile World Congress 2026 in Barcelona. The agreement was attended by LG Uplus Chief Technology Officer Le...

10 Mar 2026 | Tuesday | NEWS
Hanmi Semiconductor Joins Inauguration of Micron’s First India Packaging Facility

Hanmi Semiconductor participated in the inauguration of Micron Technology’s first semiconductor assembly and packaging facility in India, underlining the Korean company’s expanding role in the global artificial intelligence chip supply chain. The company confirmed it was invited to the opening ceremony as a major equipment supplier at Micron’s new plant in Sanand...

10 Mar 2026 | Tuesday | NEWS
Nordic Semiconductor Launches Entry-Level Bluetooth LE SoCs for Cost-Efficient Wireless Devices

Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, unveils its new entry-level, ultra-low-power Bluetooth® Low Energy (LE) Systems-on-Chip (SoCs) – the nRF54LS05A and nRF54LS05B. Both can serve as the main wireless SoC in single-chip systems, or operate as Bluetooth LE companion devices in multi-chip systems, benefiting from Nordic's market-leading B...

10 Mar 2026 | Tuesday | NEWS
Panmnesia and Openchip Sign AI Infrastructure Collaboration MOU at Mobile World Congress 2026

Panmnesia, a provider of advanced link solutions, announced that it has signed a Memorandum of Understanding (MOU) with Openchip, a European AI accelerator design company, at MWC26 in Barcelona. The agreement focuses on technical collaboration related to AI/HPC infrastructure. The agreement marks a step toward technical collaboration aimed at enhancing performance, scalability, and resource effic...

6 Mar 2026 | Friday | NEWS

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