• Tuesday | 12 May 2026
Qualinx to Showcase 1 mW GNSS Chip and Developer Kit at Embedded World 2026

Qualinx, the European semiconductor company redefining ultra-low-power connectivity, announced plans to showcase its market-ready 1 mW QLX3Gx Series GNSS chip with its dynamic reconfigurable architecture, along with a Developer Evaluation Kit (EVK), at Embedded World 2026 from 10-12 March in Nuremberg. The QLX3Gx EVK enables OEMs to directly validate Qualinx’s power-to-performance ...

9 Mar 2026 | Monday | NEWS
Mouser Electronics Executives Honored with Top Partner Awards by ODU

Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, proudly announces that Jaime Plank, Supplier Management Director, was named 2025 Strategic Partner of the Year by ODU, a valued partner and leading manufacturer of connectivity solutions. Additionally, April Kilman, Supplier Specialist, was named ODU's Supplier Manager of the ...

9 Mar 2026 | Monday | NEWS
BrainChip Expands Edge AI Reach Through Neuromorphyx Partnership

BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world leader in ultra-low power, fully digital, event-based neuromorphic AI, announced that Nex Novus d.o.o., Neuromorphyx™, has selected the Akida™ AKD1500 co-processor for evaluation and integration in its Vision NeuroNode™ edge-AI device. This strategic engagement and partnership agreement expands BrainChip&rsqu...

9 Mar 2026 | Monday | NEWS
Qnity Electronics, Inc. Acquires $61.5M Semiconductor Facility in Hsinchu Science Park

Qnity Electronics, Inc. (“Qnity”) (NYSE: Q) announced the acquisition of a new facility in Taiwan to accelerate capacity and support continued customer demand across the global semiconductor industry. The $61.5 million advanced semiconductor research and manufacturing facility marks a significant investment in Qnity’s growth to keep pace with customer demand. The new facility wi...

9 Mar 2026 | Monday | NEWS
Ambiq Micro Reveals Atomiq SoC with 300mV Ultra-Low-Power Mode on 12nm FinFET

Ambiq Micro, Inc. ("Ambiq®"), a leader in ultra-low-power semiconductor solutions for edge AI, revealed new technical details of its upcoming Atomiq™ SoC. Built on Ambiq's newly designed 12nm SPOT® platform using the TSMC N12e® process, Atomiq introduces a new Ultra-Low-Power (ULP) mode engineered to operate as low as 300mV— the lowest operating voltage in Ambiq's history. ...

6 Mar 2026 | Friday | NEWS
YY-IC Integrates ISO 9001 to Strengthen Global Electronic Component Sourcing

As the global electronics manufacturing sector faces the dual challenges of capacity volatility and geoeconomic supply fragmentation, YY-IC, a leading digital ecosystem for electronic component procurement and risk management, announced the formal integration of the ISO 9001 Quality Management System into its global operations. According to YY-IC Supply Chain Intelligence Data...

4 Mar 2026 | Wednesday | NEWS
Nordic Semiconductor Expands Cellular IoT Portfolio with nRF92 and nRF93 Series

Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, announces a major expansion of its ultra-low-power cellular IoT products and technologies designed to deliver secure, global connectivity as networks and satellite NTN evolve.  "Nordic is building the next era of cellular IoT, and we are expanding our portfolio to ...

4 Mar 2026 | Wednesday | NEWS
Magnachip Semiconductor Corporation Launches 7th-Gen 24V MOSFET for Tri-Fold Smartphones

Magnachip Semiconductor Corporation (NYSE: MX, “Magnachip”) announced the launch of its new 7th-generation 24V MXT LV MOSFET1 specifically designed for battery protection circuits in next-generation tri-fold smartphones, strengthening its presence in the premium foldable smartphone market. The product is now in mass production and is currently being supplied to a major global smar...

27 Feb 2026 | Friday | NEWS
Semtech Corporation Expands Smart Home Chip Strategy with Trident IoT Deal

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced a definitive agreement with Trident IoT that positions Semtech’s LoRa Plus™ platform as the connectivity foundation for next-generation multi-protocol smart home and security solutions. With this agreeme...

27 Feb 2026 | Friday | NEWS
Toshiba Electronic Devices & Storage Corporation Launches 135°C Photorelays for Automotive Chip Testing

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched four voltage-driven photorelays, “TLP3407SRB,” “TLP3412SRB,“ ”TLP3412SRHB,“ and “TLP3412SRLB” housed in the small S-VSON4T package. The new photorelays deliver a maximum operating temperature rating of 135°C for equipment that operates at high temperatures. Volume ...

27 Feb 2026 | Friday | NEWS
Airspan Networks Holdings LLC Launches AirUnity Small Cells Powered by EdgeQ Chip

Airspan Networks Holdings LLC (“Airspan”), a leading global provider of wireless network solutions, announced the launch of AirUnity Small Cells, a next-generation small cell portfolio designed to help mobile network operators (MNOs) and enterprises expand 4G and 5G coverage and capacity through targeted deployments that support scalable network densification across diverse indoor and ...

26 Feb 2026 | Thursday | NEWS
Renesas Electronics Corporation ADAS SoC Selected for Toyota Motor Corporation RAV4

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced that its ADAS automotive system-on-chip (SoC), R-Car V4H, has been selected for the TSS(LSS) control unit used in Toyota Motor Corporation’s new RAV4 model, which debuted in December 2025. The control unit is supplied by Denso Corporation. Engineered for advanced ADAS (Advanced Drive...

26 Feb 2026 | Thursday | NEWS
The Chemours Company Executive Joins SEMI North America Advisory Board

The Chemours Company (Chemours) (NYSE: CC), a global chemistry company, announced that Gerardo Familiar, President of the company's APM business, has been appointed to the SEMI North America Advisory Board (NAAB). SEMI is a global industry association serving thousands of member companies across the semiconductor and electronics design and manufacturing supply chain. The SEMI N...

25 Feb 2026 | Wednesday | NEWS
SambaNova Systems Unveils SN50 AI Chip, Plans Strategic Collaboration with Intel

SambaNova introduced their SN50 AI chip, which boasts a max speed that’s 5X faster than competitive chips. The company also announced a planned collaboration with Intel to deliver high‑performance, cost‑efficient AI inference solutions, and more than $350M in investment from new and existing investors. Positioned as the most efficient chip for agentic AI, the SN50 chip offers ...

25 Feb 2026 | Wednesday | NEWS
Apple Inc. Expands U.S. Chip and Semiconductor Manufacturing in Houston

Apple® announced a significant expansion of factory operations in Houston, bringing the future production of Mac mini® to the U.S. for the first time. The company will also expand advanced AI server manufacturing at the factory and provide hands-on training at its new Advanced Manufacturing Center beginning later this year. Altogether, Apple’s Houston operations will create thousands...

25 Feb 2026 | Wednesday | NEWS
Fractilia Secures First Production Deployment of FAME 300 System

Fractilia, the industry leader in high-accuracy stochastics metrology and control, announced that its FAME 300™ system has been adopted for production use by a top-five semiconductor device maker, marking the first time an in-line stochastics control solution has been fully integrated into a modern manufacturing environment. Fractilia confirmed that FAME 300 has been deployed as a fully aut...

25 Feb 2026 | Wednesday | NEWS
Baya Systems and Aion Silicon Partner to Accelerate SoC and Chiplet Development

Baya Systems, a pioneer in software-driven, chiplet-ready semiconductor fabric IP for scalable AI, high-performance computing (HPC), and automotive applications, today announced a partnership with Aion Silicon (formerly Sondrel), a leading ASIC and SoC architecture and design services company. Together, the companies are delivering a joint solution that enables faster definition, design,...

24 Feb 2026 | Tuesday | NEWS
SPIE and Cadence Design Systems, Inc. Establish Ya-Chieh Lai Memorial Scholarship

SPIE, the international society of optics and photonics, Cadence Design Systems, Inc., and the Cadence Giving Foundation have partnered to jointly fund the Ya-Chieh Lai Memorial Scholarship. Starting in 2027 and spanning five years, the annual $10,000 scholarship will be awarded to a university student during the SPIE Design Technology Co-Optimization (DTCO) conference at ...

23 Feb 2026 | Monday | NEWS
SEMIFIVE Wins U.S. Design Contract for FHE Hardware Accelerator

SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, announced that it has secured a design win from Niobium, a U.S.-based leader in Fully Homomorphic Encryption (FHE) hardware acceleration platforms. This partnership represents a strategic milestone in SEMIFIVE's expansion in the U.S. market. The contract, valued at around KRW 10 billion (USD 6.86 million), covers the...

23 Feb 2026 | Monday | NEWS
Chiplet Summit Announces 2026 Best of Show Winners Highlighting Packaging and Connectivity Innovation

The fourth annual Chiplet Summit, the largest conference dedicated to chiplets, reported on its 2026 Best of Show Awards at the Santa Clara Convention Center. The winners are: Siemens EDA for “Packaging: Design” – Their Innovator3D IC software enables fast planning and heterogeneous integration of ASICs and chiplets using 2.5D and 3D packaging technologies. UCIe Consort...

20 Feb 2026 | Friday | NEWS

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