• Wednesday | 10 June 2026
SambaNova Systems Unveils SN50 AI Chip, Plans Strategic Collaboration with Intel

SambaNova introduced their SN50 AI chip, which boasts a max speed that’s 5X faster than competitive chips. The company also announced a planned collaboration with Intel to deliver high‑performance, cost‑efficient AI inference solutions, and more than $350M in investment from new and existing investors. Positioned as the most efficient chip for agentic AI, the SN50 chip offers ...

25 Feb 2026 | Wednesday | NEWS
Apple Inc. Expands U.S. Chip and Semiconductor Manufacturing in Houston

Apple® announced a significant expansion of factory operations in Houston, bringing the future production of Mac mini® to the U.S. for the first time. The company will also expand advanced AI server manufacturing at the factory and provide hands-on training at its new Advanced Manufacturing Center beginning later this year. Altogether, Apple’s Houston operations will create thousands...

25 Feb 2026 | Wednesday | NEWS
KIOXIA America, Inc. Begins Shipping UFS 5.0 Evaluation Samples

KIOXIA America, Inc. today announced that it has begun shipping evaluation samples1 of embedded flash memory compatible with the next-generation UFS standard, UFS 5.0, which is currently being standardized by JEDEC®2. UFS 5.0 is a new standard for embedded flash storage designed to meet the performance requirements of next-generation mobile devices such as high-end smartphones equip...

25 Feb 2026 | Wednesday | NEWS
proteanTecs and Gubo Technologies Partner to Enhance AI Chip Visibility

proteanTecs®, a leading provider of deep data health and performance monitoring solutions for advanced electronics, and Gubo Technologies Co., Ltd., China’s first post silicon workflow automation solution provider, today announced a collaboration to deliver combined semiconductor analytics solutions. The collaboration is intended to provide broad, actionable insights into yield, quality,...

25 Feb 2026 | Wednesday | NEWS
Fractilia Secures First Production Deployment of FAME 300 System

Fractilia, the industry leader in high-accuracy stochastics metrology and control, announced that its FAME 300™ system has been adopted for production use by a top-five semiconductor device maker, marking the first time an in-line stochastics control solution has been fully integrated into a modern manufacturing environment. Fractilia confirmed that FAME 300 has been deployed as a fully aut...

25 Feb 2026 | Wednesday | NEWS
Baya Systems and Aion Silicon Partner to Accelerate SoC and Chiplet Development

Baya Systems, a pioneer in software-driven, chiplet-ready semiconductor fabric IP for scalable AI, high-performance computing (HPC), and automotive applications, today announced a partnership with Aion Silicon (formerly Sondrel), a leading ASIC and SoC architecture and design services company. Together, the companies are delivering a joint solution that enables faster definition, design,...

24 Feb 2026 | Tuesday | NEWS
Powerchip Semiconductor Manufacturing Company Partners with Intel and SoftBank to Develop AI Memory Alternative

Powerchip Semiconductor Manufacturing Company (PSMC) has joined forces with major technology players, including Intel and SoftBank, in a collaborative effort to develop an alternative memory solution to high-bandwidth memory (HBM) for artificial intelligence applications. The initiative aims to reduce reliance on existing memory technologies and strengthen supply chain resilience for next-generati...

24 Feb 2026 | Tuesday | NEWS
SPIE and Cadence Design Systems, Inc. Establish Ya-Chieh Lai Memorial Scholarship

SPIE, the international society of optics and photonics, Cadence Design Systems, Inc., and the Cadence Giving Foundation have partnered to jointly fund the Ya-Chieh Lai Memorial Scholarship. Starting in 2027 and spanning five years, the annual $10,000 scholarship will be awarded to a university student during the SPIE Design Technology Co-Optimization (DTCO) conference at ...

23 Feb 2026 | Monday | NEWS
SEMIFIVE Wins U.S. Design Contract for FHE Hardware Accelerator

SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, announced that it has secured a design win from Niobium, a U.S.-based leader in Fully Homomorphic Encryption (FHE) hardware acceleration platforms. This partnership represents a strategic milestone in SEMIFIVE's expansion in the U.S. market. The contract, valued at around KRW 10 billion (USD 6.86 million), covers the...

23 Feb 2026 | Monday | NEWS
Draper and Northeast Microelectronics Coalition Partner to Accelerate Lab-to-Fab Transitions

Draper and the Northeast Microelectronics Coalition (NEMC) announced that Draper will provide advisory services and support to startups and small companies within NEMC's membership to de-risk and accelerate lab-to-fab technology transition. The formal introduction will be made at the 2026 Microelectronics Commons Annual Meeting in Washington, D.C. These services build upon the NEMC's Po...

23 Feb 2026 | Monday | NEWS
AI Trading Agents Post 108% Gains in Semiconductor Rally

Tickeron has reported notable outperformance from its artificial intelligence trading agents focused on the semiconductor sector, with certain strategies generating returns exceeding 100 per cent. The results reflect heightened investor interest in chipmakers and equipment suppliers amid continued momentum in AI-driven technologies. According to the company, its AI-based trading models achieved s...

23 Feb 2026 | Monday | NEWS
Datasea Inc. Announces Ultrasonic Precision Control Breakthrough for Semiconductor Manufacturing

Datasea Inc. (NASDAQ: DTSS) ("Datasea" or the "Company"), a Nevada-based technology company specializing in acoustic high-tech solutions and 5G+AI multimodal digitalization, announced that it has achieved a foundational research breakthrough in its ultrasonic-enhanced nanoscale precision control technology, representing a step-change in the Company's technical architecture and under...

20 Feb 2026 | Friday | NEWS
EV Group Launches Next-Generation EVG120 Resist Processing System

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, unveiled the next-generation EVG®120 automated resist processing system — a major update to one of the company's leading coater/developer platforms. Incorporating a new compact architecture, breakthrough capabilities, and des...

20 Feb 2026 | Friday | NEWS
Valens Semiconductor and MCNEX Launch QHD Automotive Cameras Using MIPI A-PHY Connectivity

MCNEX and Valens Semiconductor (NYSE: VLN) announced the joint development and availability of a new family of high–resolution front and rear automotive cameras that deliver QHD (2560×1440) video over unshielded twisted pair (UTP) or low-cost Coax channels, powered by Valens' VA7000 A–PHY chipsets. The cameras enable OEMs to significantly reduce the cost and complexity ...

20 Feb 2026 | Friday | NEWS
Chiplet Summit Announces 2026 Best of Show Winners Highlighting Packaging and Connectivity Innovation

The fourth annual Chiplet Summit, the largest conference dedicated to chiplets, reported on its 2026 Best of Show Awards at the Santa Clara Convention Center. The winners are: Siemens EDA for “Packaging: Design” – Their Innovator3D IC software enables fast planning and heterogeneous integration of ASICs and chiplets using 2.5D and 3D packaging technologies. UCIe Consort...

20 Feb 2026 | Friday | NEWS
Renesas Electronics Corporation Develops Next-Gen Automotive SoC Platform for Software-Defined Vehicles

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, has developed three System-on-Chip (SoC) technologies for automotive multi-domain electronic control units (ECUs). They feature advanced AI processing capabilities and chiplet functions, serving as the core technology platform for next-generation automotive electrical/electronic (E/E) architectures....

20 Feb 2026 | Friday | NEWS
Renesas Electronics Corporation Unveils 3nm TCAM for Automotive and High-Speed Networks

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced a configurable ternary content-addressable memory (TCAM) built on a 3nm FinFET process. The new TCAM simultaneously delivers higher density, lower power and strengthened functional safety, making it suitable for automotive applications. Renesas presented the results at the International So...

20 Feb 2026 | Friday | NEWS
Lattice Semiconductor Launches Cyber Resilience Kit to Strengthen Industrial Edge Security

Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiP...

19 Feb 2026 | Thursday | NEWS
Keysight Technologies, Inc. Launches 3D Interconnect Designer to Accelerate AI Chip and Chiplet Development

Keysight Technologies, Inc. (NYSE: KEYS) introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The solution addresses the mounting complexity of designing 3D interconnects for high-chiplet and 3DIC advanced packages used in AI infrastructure and data center applications. As chiplet architectures are increasingly adopted, engineers face compl...

19 Feb 2026 | Thursday | NEWS
Efinix, Inc. Appoints Semiconductor Veteran BC Ooi to Board to Support Edge AI Growth

Efinix®, Inc., the FPGA pioneer accelerating edge AI innovation, announced that Boon Chye (BC) Ooi has joined its Board of Directors. Ooi, a semiconductor industry veteran with more than 45 years of operational leadership experience, will provide strategic guidance as Efinix scales its business and expands its market presence in FPGA and edge AI applications. Ooi brings unparalleled expertise...

19 Feb 2026 | Thursday | NEWS

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