Toshiba adds 40V TCKE6 series eFuse ICs with advanced protection features

-Toshiba Electronic Devices & Storage Corporation (”Toshiba”) has added the 40V "TCKE6 series" products to its range of electronic fuses (eFuse ICs) that support multiple functions required for power line circuit protection. The five new products joining the lineup are “TCKE601RA,” “TCKE601RL,” “TCKE602RM,” “TCKE603RA,” and “T...

10 Dec 2025 | Wednesday | NEWS
Rapidus To Build 1.4 Nm Advanced Chip Fabrication Facility In Japan By 2027

Japanese semiconductor start up Rapidus has announced plans to construct a 1.4 nm process node fabrication facility, marking a bold step in the country ambition to re enter the front ranks of advanced global chip manufacturing. Research and development activities for the facility are expected to begin in 2026, with volume production targeted for 2029. Once operational, the plant is ...

9 Dec 2025 | Tuesday | NEWS
Rigaku Launches XTRAIA MF-3400 to Enable Nanoscale Film Measurement for Next-Generation Semiconductor Manufacturing

Rigaku Corporation, a global solution partner in X-ray analytical systems and a group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”) has launched the XTRAIA MF-3400, an instrument used in semiconductor manufacturing processes to measure the thickness and composition of wafers. The XTRAIA MF-3400 will significantly enhan...

8 Dec 2025 | Monday | NEWS
Mitsubishi Electric Develops World’s First Microbubble-Driven Millimeter-Scale Flow Technology for Next-Generation Electronic Cooling

Mitsubishi Electric Corporation (TOKYO: 6503) announced  that it has developed the world’s first technology to generate millimeter-scale flow within a channel by using microbubbles with a diameter of 10μm as the driving source. Developed through joint research with Suzuki & Namura Laboratory at Faculty of Engineering and Graduate School of Engineering, Kyoto University, this te...

5 Dec 2025 | Friday | NEWS
Asahi Kasei Divests Daramic Lead Battery Separator Business to Kingswood Capital as Part of Strategic Portfolio Realignment

Asahi Kasei, a diversified global manufacturer in the Healthcare, Homes, and Material sectors, announces its strategic divestiture of Daramic, a lead battery separator business, to Kingswood Capital Management, LP. The Daramic business transfer closed on December 1, 2025. The effect on Asahi Kasei’s consolidated financial results for fiscal 2025 is immaterial. “As we enter a new era...

4 Dec 2025 | Thursday | NEWS
Kioxia Corporation Announces Clean-Power Collaboration With Google to Accelerate Hydropower Adoption in Japan

As part of its commitment towards a more sustainable future, Kioxia Corporation (“Kioxia”) today announced a collaborative initiative with Google LLC (“Google”) to boost its use of the clean electricity generated by a hydropower retrofit project in Japan's Chubu region. This project, owned by the Chubu Electric Power group, is expected to increase annual clean energy gene...

4 Dec 2025 | Thursday | NEWS
Murata Launches 1.25kV C0G MLCC in Compact 1210 Size for SiC-Based Power Systems

Murata Manufacturing Co., Ltd. (TOKYO: 6981) (ISIN: JP3914400001) announces the launch and mass production of its multilayer ceramic capacitor (MLCC) featuring a capacitance of 15nF, a rated voltage of 1.25kV, and C0G characteristics in the compact 1210-inch (3.2mm x 2.5mm) size. This product delivers highly efficient power conversion and stable performance under high-voltage conditions, making ...

3 Dec 2025 | Wednesday | NEWS
Mitsubishi Electric Launches New 4.5kV/1,200A HVIGBT Modules With Enhanced Isolation and Moisture Resistance

For highly efficient, reliable inverter systems in railcars and large industrial equipment Mitsubishi Electric Corporation (TOKYO: 6503) announced that it will launch new standard-isolation (6.0kVrms) and high-isolation (10.2kVrms) modules in its 4.5kV/1,200A XB Series of high-voltage insulated-gate bipolar transistors (HVIGBTs) on December 9. These new high-capacity power semiconduct...

3 Dec 2025 | Wednesday | NEWS
Tower Semiconductor Gains Nearly 5% After Revealing New Manufacturing Collaborations

Tower Semiconductor (NASDAQ/TASE: TSEM), a leading foundry of high-value analog semiconductor solutions, saw its stock rise approximately 5%  after unveiling a series of new strategic collaborations aimed at expanding its chip-manufacturing capabilities and strengthening its global technology roadmap. The market responded positively to Tower’s newly announced partnerships, which are ...

1 Dec 2025 | Monday | NEWS
Micron to Invest $9.6 Billion in New AI Memory Chip Plant in Japan

Micron Technology, Inc., a global leader in memory and storage solutions, today announced plans to invest $9.6 billion in the construction of a new advanced semiconductor fabrication facility in Hiroshima, Japan. The new plant will focus on producing next-generation high-bandwidth memory (HBM) chips designed to power the world’s rapidly expanding artificial intelligence (AI) and high-perfo...

1 Dec 2025 | Monday | NEWS
TDK Corporation and Nippon Chemical Industrial Begin Discussions on Joint Venture for Advanced Electronic Component Materials

TDK Corporation and Nippon Chemical Industrial Co., Ltd. have announced the signing of an agreement to begin formal discussions toward establishing a joint venture dedicated to next generation electronic component materials. The proposed venture would focus on the co development and manufacturing of ceramic materials for multilayer capacitors as well as other high value materials essential to se...

28 Nov 2025 | Friday | NEWS
Sony Introduces LYTIA 901, a Large Format Mobile Sensor with Two Hundred Megapixel Power

Sony Semiconductor Solutions Corporation has announced the forthcoming release of the LYTIA 901, a 1/1.12-type large-format mobile image sensor offering approximately 200 effective megapixels. The new flagship device brings together Sony’s next-generation pixel architecture, advanced HDR technologies and an industry-first AI learning-based remosaicing engine mounted directly on the sensor....

28 Nov 2025 | Friday | NEWS
Fujifilm Completes New Building to Boost Its Semiconductor Materials Business

Fujifilm has announced the completion of a new state-of-the-art building at its Shizuoka site in Japan, marking a significant expansion of its semiconductor materials operations. The facility is designed to strengthen the company’s research, development and quality-evaluation capabilities as global demand for sophisticated chipmaking materials continues to rise. Situated within the Fujifi...

28 Nov 2025 | Friday | NEWS
Shin-Etsu Chemical’s 300-mm QST™ Substrate Enables IMEC to Achieve World-Record 800V GaN HEMT Breakdown Voltage

The QSTTM substrate*1, a 300-mm GaN growth substrate that Shin-Etsu Chemical Co., Ltd. (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) developed, has been adopted for the 300-mm GaN power device development program at IMEC*2, where sample evaluation is in progress. In the evaluation, the 5 µm-thick HEMT*3 device using a QSTTM substrate achiev...

17 Nov 2025 | Monday | NEWS
Taiyo Holdings and imec Demonstrate Breakthrough Fine-Pitch RDL Material for Next-Generation Semiconductor Packaging

Taiyo Holdings Co., Ltd. (Securities Code: 4626; hereinafter referred to as "Taiyo Holdings"), based in Tokyo, presented a paper, co-authored with imec, one of the world's largest semiconductor research institutions, at the 14th IEEE CPMT Symposium Japan (ICSJ2025), focusing on the "FPIM (TM) Series" (hereinafter referred to as "this material"), a negative-type photosensitive insula...

14 Nov 2025 | Friday | NEWS
Renesas Sets New Standard for DDR5 Memory Interfaces with 9600 MT/s RCD Optimized for AI and HPC Workloads

Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, announced that it has delivered the industry’s first sixth-generation Registered Clock Driver (RCD) for DDR5 Registered Dual In-line Memory Modules (RDIMMs). The new RCD is the first to achieve a data rate of 9600 Mega Transfers Per Second (MT/s), surpassing the industry standard. This brea...

13 Nov 2025 | Thursday | NEWS
Samsung Electro-Mechanics and Sumitomo Chemical Group Strengthen Strategic Collaboration on Glass Core Substrates

Strengthening strategic cooperation for next-generation semiconductor package core material 'Glass Core' Aiming to lead the glass substrate market by combining strengths in preparation for the AI era Samsung Electro-Mechanics announced on the 5th that it has signed a memorandum of understanding (MOU) with Sumitomo Chemical Group to establish a joint venture (JV) for man...

7 Nov 2025 | Friday | NEWS
Magnachip and Hyundai Mobis Advance Next-Gen IGBT Technology for Electric Vehicle Traction Systems

Magnachip Semiconductor Corporation (NYSE: MX) (“Magnachip” or the “Company”)  announced it has concluded an agreement with Hyundai Mobis Company Limited (hereinafter “MOBIS”) regarding the use of high-performance Insulated Gate Bipolar Transistor (IGBT) technology, and plans to expand its business based on this technology. Hyundai Mobis is a global auto ...

5 Nov 2025 | Wednesday | NEWS
Toshiba Launches S300 AI High-Capacity Surveillance HDDs Built for the AI-Driven Era

The new high-capacity, high-performance storage is purpose-built for the demands of modern AI-enabled surveillance systems Toshiba Electronic Devices & Storage Corporation (Toshiba) has introduced S300 AI, a new generation of surveillance hard disk drives (HDDs) engineered for the requirements of modern artificial intelligence (AI) driven video applications. Purpose-built for high...

5 Nov 2025 | Wednesday | NEWS
Canaan Deploys Hydro-Cooled Avalon® A1566HA Servers at Major Japanese Utility

Hydro-cooled Avalon® A1566HA servers deployed at major Japanese utilityProject underscores Canaan's ability to support grid efficiency amid rising residential and data-center power demand Canaan Inc., an innovator in crypto mining, announced a 4.5-megawatt sales contract with an electrical engineering solutions provider to deploy Avalon A1566HA-488T hydro-cooled mining servers for real-time...

31 Oct 2025 | Friday | NEWS