• Monday | 30 March 2026
SEALSQ Corp Showcases Post-Quantum Security for Physical AI at Davos

SEALSQ Corp (NASDAQ: LAES) (“SEALSQ” or the “Company”), a global leader in semiconductors, PKI, and post-quantum cryptography (PQC) hardware and software solutions, announced a live demonstration exploring its Post-Quantum Cryptography Robotic Concept during the Physical AI Roundtable held in Davos on the margins of the World Economic Forum Annual Meeting. The demonstration...

30 Mar 2026 | Monday | NEWS
MIPS, Inova Semiconductors and GlobalFoundries Partner to Accelerate Scalable Robotics Platforms

MIPS, a GlobalFoundries company, announced a collaboration with Inova Semiconductors GmbH, to deliver a robotics control reference platform for advanced humanoids and physical AI edge platforms. Building on the strengths of Inova’s Automotive expertise in zonal architectures, the platform will enable mixed-criticality compute featuring real-time control loops and secure AI workloads, manufac...

30 Mar 2026 | Monday | NEWS
DEEPX Accelerates Global Adoption with Rapid Edge AI Chip Orders

DEEPX, a Seoul-based fabless semiconductor company developing ultra-low-power AI inference chips for physical AI applications, has secured 27 commercial purchase orders across eight countries within seven months of starting mass production of its first-generation AI chip — a pace that industry observers describe as highly unusual for an emerging fabless company at such an early sta...

30 Mar 2026 | Monday | Spotlight
GS Microelectronics U.S., Inc. and Tarana Wireless, Inc. Expand Strategic RF Partnership to Accelerate Next-Gen Wireless Innovation

GS Microelectronics U.S., Inc. (GSME) announced a strategic partnership with Tarana Wireless, Inc. to support RF transceiver products and accelerate the future roadmap of wireless technologies. The deal strengthens the long-standing partnership between GSME and Tarana, enhancing the overall market value by providing dedicated RF-Analogue engineering support for Tarana's products. The team will sup...

30 Mar 2026 | Monday | NEWS
Wolfspeed Strengthens Balance Sheet with Strategic Refinancing

Wolfspeed, Inc. (NYSE: WOLF) (“Wolfspeed” or the “Company”), a global leader in silicon carbide technology, announced the closing of its previously announced private placements of convertible notes, common stock, and pre-funded warrants (the “Private Placements”). In connection with the Private Placements, the Company redeemed approximately $475.9 million of the...

30 Mar 2026 | Monday | NEWS
AR Alliance Strengthens Global AR Supply Chain with New Member Additions

The AR Alliance, a division of SPIE that is focused on augmented reality (AR), proudly announces the addition of Ainstec, ams-Osram, Fraunhofer ISIT, Hong Kong Highpower International Co., Infineon, Kyocera Corporation, Morphotonics, Moveon Technologies, Murata Manufacturing Co., Seagate, Sunny Optical Technology, and Ushio to its membership. SPIE is the international society for optics ...

30 Mar 2026 | Monday | NEWS
Guerrilla RF Moves Closer to Profitability with Record Q4 Revenue and Strong Margin Expansion

Guerrilla RF, Inc. (OTCQX: GUER), a leading provider of high-performance radio frequency (RF) and microwave semiconductors, reported fourth quarter and full year 2025 financial results, highlighting a major financial inflexion point with the Company achieving operating profitability and positive operating cash flow in the fourth quarter. The results reflect strong revenue growth, disciplined...

27 Mar 2026 | Friday | NEWS
Argonne National Laboratory Develops On-Chip Data Compression Technology for High-Speed Scientific Experiments

Every second, scientific experiments produce a flood of data — so much that transmitting and analysing it can slow down even the most advanced research. To help scientists better manage this data deluge, researchers at the U.S. Department of Energy’s (DOE) Argonne National Laboratory have developed a new computer chip that rapidly compresses and processes the huge amounts of ...

27 Mar 2026 | Friday | NEWS
Nox Group Expands into Reno with Major Data Centre Development

Nox Group, a hyper-scale industrial builder, is making a new home in Reno through a major data centre development, driving investment in the region’s workforce as it enters one of the country’s most sought-after markets for mission-critical infrastructure. Nox Group is one of the fastest-growing construction enterprises in the United States with four operating companies, including ele...

27 Mar 2026 | Friday | NEWS
Sivers Semiconductors Reaffirms Investor Confidence Amid Kairos Ventures Share Rebalancing

Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, clarifies the background to the reduction in Kairos Ventures' holdings of Sivers Semiconductors shares as disclosed through the notification to the insider register on March 25, 2026. The reduction is related to periodic fund level rebalancing and payment of fund expenses at Kairos. "Both Kairos and...

27 Mar 2026 | Friday | NEWS
Normal Computing Secures $50M to Accelerate AI-Driven Semiconductor Design

Normal Computing announced $50 million in strategic funding led by Samsung Catalyst Fund, bringing total funding to more than $85 million. New investors also include Galvanise, Brevan Howard Macro Venture Fund, and ArcTern Ventures, alongside existing investors Celesta Capital, Drive Capital, Eric Schmidt's First Spark Ventures, and Micron Ventures. Normal was founded to tackle two converging cr...

26 Mar 2026 | Thursday | NEWS
EPIC Microsystems Secures $21M Series A to Advance AI Data Centre Power Delivery

 EPIC Microsystems, a semiconductor company developing breakthrough power delivery solutions for AI infrastructure, announced it has raised an oversubscribed $21 million in Series A funding to accelerate the development and commercialisation of its vertical power delivery technology for next-generation AI compute platforms. The funding round was led by Seligman Ventures, with participation fr...

26 Mar 2026 | Thursday | NEWS
Frontgrade Technologies Launches MAMBA Architecture for Scalable Space Mission Processing

Colo.--(BUSINESS WIRE)--Frontgrade™ Technologies, a leading provider of high-reliability electronic solutions for space and national security missions, announced two complementary products delivering scalable, high-performance processing and high-speed connectivity for next-generation missions: the RPMG1-SVPX Reconfigurable Processing Module and the FIOM-RPMG1 Fibre Optic Mezzanine Card. Tog...

26 Mar 2026 | Thursday | NEWS
Pacific Defence Launches AI-Enabled DSP3100VP for Edge Intelligence Applications

Pacific Defence announced the launch of the DSP3100VP, a next-generation digital signal processing module engineered to bring advanced artificial intelligence and machine learning (AI/ML) capabilities to the edge. Built on the AMD Versal™ AI Edge Series Gen 2 adaptive SoC, the DSP3100VP combines heterogeneous compute, adaptive acceleration, and deterministic real-time control to meet th...

26 Mar 2026 | Thursday | NEWS
Agileo Automation Launches Agil'EDA to Enable Next-Gen Fab Connectivity

Agileo Automation, a leading global provider of control and connectivity solutions for semiconductor manufacturing, unveils Agil'EDA, a new software implementing Equipment Data Acquisition (EDA/Interface A). This solution enables semiconductor equipment manufacturers to meet the evolving high-performance connectivity requirements of tier-one fabs and advanced packaging facilities. As semicon...

26 Mar 2026 | Thursday | NEWS
OKI Launches Comprehensive EMS for AI Server Manufacturing

OKI (TOKYO: 6703) will launch Comprehensive Electronics Manufacturing Services (EMS) for AI server equipment on March 25, 2026. These comprehensive services will cover all processes, from the design and production of large-size multi-layer printed circuit boards (PCBs) incorporating OKI’s proprietary high heat dissipation technology supporting high-speed high-capacity data transmission, to c...

26 Mar 2026 | Thursday | NEWS
JEDEC Solid State Technology Association Updates LPDDR5/5X SPD Standard to Enhance Power Efficiency

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, announced the publication of JESD406-5D: LPDDR5/5X Serial Presence Detect (SPD) Contents standard, an update of the Revision C standard that adds support for calculating recovery time when switching operating modes. JESD406-5D is available for free download from the JEDEC we...

25 Mar 2026 | Wednesday | NEWS
Keysight Technologies Launches Semiconductor Lab Solutions to Bridge Skills Gap

Keysight Technologies, Inc. (NYSE: KEYS) announced three new semiconductor teaching lab solutions designed to help universities prepare students for careers in the global semiconductor industry. The three solutions—Basic Design and Measurement, Parametric Test and On-Wafer Measurement, and Photonics IC Measurement—provide students with practical experience using professional-grade...

25 Mar 2026 | Wednesday | NEWS
DG Matrix Partners with Infineon Technologies AG to Advance SiC-Based Power Infrastructure

DG Matrix, the global leader in solid-state transformer solutions, announced that it will source the latest-generation silicon carbide (SiC) MOSFETs from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a global semiconductor leader in power systems and IoT, for use in its Interport™ multi-port solid-state transformer platform. The relationship strengthens DG Matrix’s semiconductor ...

25 Mar 2026 | Wednesday | NEWS
Semtech Corporation Launches Industry-First Surge Protection Device for 48V USB PD EPR Systems

Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductors powering data center networking, Internet of Things (IoT) connectivity and cellular infrastructure solutions, announced the TDS5311P, the industry’s first circuit protection device to deliver near-constant clamping voltage for USB Power Delivery (PD) Extended Power Range (EPR) applications at ...

25 Mar 2026 | Wednesday | NEWS

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