• Monday | 28 September 2026
Shanghai Chengwei Launches High-Purity Chemical Delivery Systems for Advanced Manufacturing

Shanghai Chengwei Semiconductor Equipment has announced the global commercial launch of new high-purity chemical delivery and bulk chemical distribution systems designed for advanced semiconductor manufacturing. The company said the systems are intended to support stringent contamination-control requirements in semiconductor fabs, as well as flat-panel display and photovoltaic production facilitie...

28 Sep 2026 | Monday | NEWS
Tower Semiconductor Plans US$3 Billion Japan Expansion for Silicon Photonics and Optical Packaging

  Tower Semiconductor is set to invest up to US$3 billion in expanding its semiconductor manufacturing operations in Japan, with additional government support taking the total investment to around US$4 billion. The expansion is aimed at creating a large-scale manufacturing hub for silicon photonics, silicon-germanium electronic integrated circuits and advanced optical packaging. ...

28 Sep 2026 | Monday | NEWS
Singapore Launches SG Semiconductor Initiative to Expand Advanced R&D and Manufacturing

Singapore has introduced a new national initiative, SG Semiconductor, to strengthen the global profile of its semiconductor industry and attract further investment in advanced research and manufacturing. Developed by the Agency for Science, Technology and Research (A*STAR) and the Economic Development Board (EDB), the initiative will present Singapore’s semiconductor research, manufacturing ...

28 Sep 2026 | Monday | NEWS
Gigaphoton Installs KrF Excimer Laser to Advance High-Temperature Superconducting Wire Manufacturing

Gigaphoton Inc. (Head Office: Oyama, Tochigi; President and CEO: Tatsuo Enami), a manufacturer of lightsources for leading-edge semiconductor fabrication processes, announced that it has installed its L300KZ KrF excimer laser for pulsed laser deposition (PLD) at a domestic manufacturer of high-temperature superconducting wire on September 25, 2026. Developed under Goal 10 of Japan’s Moonshot...

28 Sep 2026 | Monday | NEWS
Renesas Launches Smallest GreenPAK Device to Enable More Compact Consumer Electronics

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced the SLG46801, the industry’s smallest GreenPAK configurable mixed-signal device offered in both WLCSP and STQFN packages. The 9-ball WLCSP measures just 1.155 mm × 1.155 mm and combines an ultra-small footprint with multi-time programmability to enable designers to reduce board...

28 Sep 2026 | Monday | NEWS
ACCM Expands US Manufacturing Capacity for Celeritas Materials Supporting AI Hardware

Advanced Chip and Circuit Materials, Inc. (ACCM) announced a major expansion of its US manufacturing capacity for the Celeritas® family of advanced dielectric materials, covering the four segments of AI hardware where material supply and performance currently constrain system design: ultra-high-speed skew-free materials, low- and negative-expansion laminates for large accelerator boards, IC su...

28 Sep 2026 | Monday | NEWS
Shanghai Chengwei Semiconductor Equipment Launches Central Gas Supply System for Advanced Laboratories

Shanghai Chengwei Semiconductor Equipment Co., Ltd. has officially announced the launch of its latest laboratory central gas supply system. This high-purity engineering infrastructure solution is designed to meet the rigorous gas delivery demands of modern semiconductor research and development facilities, advanced university laboratories, and precision testing centres. By consolidating multiple s...

25 Sep 2026 | Friday | NEWS
Toshiba Launches 3300V 800A SiC MOSFET Module for High-Efficiency Industrial Power Systems

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has expanded its lineup with the launch of “IX800FXF2YMS4,” a dual SiC MOSFET module for industrial equipment, including railway vehicles, renewable energy power generation systems and power conversion systems. The new module features Toshiba’s third-generation silicon carbide (SiC) MOSFET chips, a drain...

25 Sep 2026 | Friday | NEWS
REX Shares Launches CHIP ETF to Capture Global AI Chipmaking Equipment Growth

REX Shares (“REX”), a leading innovator in alternative ETFs, announced the launch of the REX AI Chipmaking ETF (Ticker: CHIP), a thematic ETF built to own the equipment layer of the Artificial Intelligence buildout. CHIP holds the companies that make the tools each AI chip has to pass through: wafer fabrication equipment, advanced packaging, and metrology, rather than the chip designer...

25 Sep 2026 | Friday | NEWS
Cadence and TSMC Expand AI and HPC Design Collaboration Across Advanced Nodes and 3D-IC

Cadence (Nasdaq: CDNS) announced an expanded partnership with TSMC to deliver advanced capabilities for AI and HPC designers. Cadence has achieved tool certification for TSMC’s advanced A14 process, demonstrated an industry-leading UALink solution in TSMC N3P, and introduced new silicon-proven IP for N3P and N2P technologies. Through this partnership, the companies are enabling agentic AI ch...

25 Sep 2026 | Friday | NEWS
EdgeCortix Unveils RAIDEN Chiplet Platform to Scale High-Performance Physical AI

Physical AI has a system problem. Machines that perceive, reason and act in the real world cannot scale by adding AI accelerators alone. Compute, memory capacity, memory bandwidth, connectivity, and software must scale together and continue scaling as the AI models and application workloads evolve. EdgeCortix®, a leading Japanese fabless semiconductor company specialising in energy-effici...

25 Sep 2026 | Friday | NEWS
Synopsys and TSMC Expand AI Chip Design Collaboration with Agentic AI and Advanced Packaging

Synopsys (Nasdaq: SNPS) announced innovations with TSMC that accelerate the development of next-generation AI, high-performance computing (HPC), and advanced semiconductor systems. Through AI-powered EDA flows, multiphysics-aware signoff methodologies, multi-die design flows, and silicon-proven Interface and Foundation IP, Synopsys and TSMC are helping customers address growing design complex...

25 Sep 2026 | Friday | NEWS
Cognex Launches In-Sight 1750 for AI-Driven Wafer Traceability and Semiconductor Production

Cognex Corporation (NASDAQ: CGNX), the global technology leader in industrial machine vision, announced the launch of the In-Sight® 1750 Series, a next-generation wafer and panel identification system designed to help semiconductor manufacturers reduce disruptions, improve traceability, and maintain throughput. As semiconductor manufacturers expand capacity to support AI infrastructure, advan...

24 Sep 2026 | Thursday | NEWS
IonQ and SDT Strengthen South Korea Quantum Ecosystem with Superion 256 Partnership

IonQ (NYSE: IONQ), the world’s leading full-stack quantum platform and foundry, announced a strategic partnership with Korea-based quantum technology and software company SDT, Inc. Under this multi-year collaboration, IonQ will supply SDT with a Superion 256 quantum computer as well as IonQ’s silicon-vacancy (SiV) quantum memory module. "Demand for our new Superion 256 system is growi...

24 Sep 2026 | Thursday | NEWS
ChipAgents and eMemory Accelerate Semiconductor IP Verification with Agentic AI

ChipAgents, the category leader in agentic AI platforms for semiconductor design, announced that eMemory, a leading pure-play developer and provider of logic-based non-volatile memory (Logic NVM), founded in 2000, has deployed ChipAgents to automate critical portions of its functional-model verification workflow for NVM IP. Using ChipAgents, eMemory reduced the engineering effort for datasheet an...

24 Sep 2026 | Thursday | NEWS
Ezurio Launches BL54LM20 Series with Edge AI for Scalable IoT Connectivity

Ezurio, a global leader in connectivity and embedded compute technology, announces the BL54LM20 Series: the BL54LM20A, BL54LM20B, and BL54LM20B USB-C Adapter. Built on Nordic Semiconductor's new nRF54LM20A and nRF54LM20B SoCs, the BL54LM20 Series brings USB, more memory, more I/O, and, for the first time in the BL54L family, module-level Edge AI capability to market. Pairing a 128 MHz Arm Cortex-...

24 Sep 2026 | Thursday | NEWS
GSME and Teradyne Partner to Accelerate Semiconductor Test and Production Readiness

GS Microelectronics U.S., Inc. (GSME), a fast-growing semiconductor solutions provider, and Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, announced a multi‑year strategic partnership to establish a state‑of‑the‑art semiconductor test and evaluation center designed to accelerate customer time‑to‑market. The collaboration integra...

24 Sep 2026 | Thursday | NEWS
TransPak Expands Southeast Asia Presence with New Thailand Facility

TransPak, a global provider of crating, packaging and logistics solutions, announced the opening of its new facility in Chonburi, Thailand, expanding the company's capabilities across Southeast Asia. Located in the Namyong Terminal Free Zone in the Bueng Subdistrict of Si Racha District, the 2,318-square-meter (approximately 24,950-square-foot) facility offers packaging, final assembly, pack-on-s...

24 Sep 2026 | Thursday | NEWS
Valens Semiconductor and onsemi Collaborate on Cost-Optimised 3MP Automotive Camera Solution

Valens Semiconductor (NYSE: VLN), a leading provider of high-performance connectivity chipsets, announced a collaboration with onsemi on a cost-optimised integrated sensor for high-volume 3-megapixel automotive camera applications. Through this collaboration, the parties intend to give OEMs and Tier 1s a faster path to A-PHY. Under the agreement, Valens will work with onsemi on the cost-optimised...

23 Sep 2026 | Wednesday | NEWS
STARTRADER Launches 24/7 CFDs Referencing CXMT and Unitree Robotics

STARTRADER announced the launch of two new 24/7 CFD instruments: CXMTUSD (CXMT Corporation) and UNITREEUSD (Unitree Robotics), available Monday through Sunday, 00:00–24:00 (GMT+3 platform time), subject to scheduled maintenance windows. Both instruments are USD-denominated CFDs referencing Shanghai-listed companies. The AI story has focused largely on software, while the hardware behind it ...

23 Sep 2026 | Wednesday | NEWS

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