Targeting global bird flu risk: safe UV light technology protects biosecurity and food supplies Silanna UV's Ultraviolet LEDs effectively inactivate multiple H5N1 avian influenza virus strains within seconds, according to recent research by scientists at the University of Siena. The research showed strong viral reduction of up to 99.999% with Silanna's 235nm Far Ultraviolet C (UVC) LEDs. The...
Semiconductor Startup Sophrosyne Technologies Raises $2Mn in Seed round from Bluehill.VC Bangalore based Sophrosyne Technologies is a deep-tech Indian startup pioneering advanced System-on-Chip (SoC) solutions for medical and healthcare applications. Leveraging cutting-edge advancements in high-precision analog circuit design, Sophrosyne is developing ultra-low power, high-precision arch...
Equinix and Lenovo to provide digital foundation for Merck KGaA, Darmstadt, Germany— from accelerating drug discovery to pioneering new materials for next-generation semiconductor chips Equinix, Inc. (Nasdaq: EQIX), the world's digital infrastructure company®, announced Merck KGaA, Darmstadt, Germany, a leading science and technology company, has successfully launched a ...
Galbot is proud to announce two major technological advancements in embodied intelligence: DexNDM, a neural dynamics model designed to revolutionize robotic dexterous manipulation, and NavFoM, the world's first cross-embodiment, cross-task navigation foundation model. Developed in collaboration with Tsinghua University, Peking University, University of Adelaide, and Zhejiang University, these in...
The QSTTM substrate*1, a 300-mm GaN growth substrate that Shin-Etsu Chemical Co., Ltd. (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) developed, has been adopted for the 300-mm GaN power device development program at IMEC*2, where sample evaluation is in progress. In the evaluation, the 5 µm-thick HEMT*3 device using a QSTTM substrate achiev...
Trio-Tech International (NYSE MKT: TRT), a comprehensive provider of semiconductor back-end solutions and a global value-added supplier of electronic equipment, today announced financial results for its fiscal first quarter ended September 30, 2025. The Company reported 58% year-over-year revenue growth, driven by strong performance across both its Semiconductor Back-End and Industrial Electroni...
Targeting edge LLM applications, accelerating edge AI ecosystem development VeriSilicon (688521.SH) recently announced the joint launch of the Coral NPU IP with Google, targeting always-on, ultra-low-energy edge Large Language Model (LLM) applications. The IP is based on Google’s foundational research in open machine learning compilers and enhanced with AI security features, pro...
Taiyo Holdings Co., Ltd. (Securities Code: 4626; hereinafter referred to as "Taiyo Holdings"), based in Tokyo, presented a paper, co-authored with imec, one of the world's largest semiconductor research institutions, at the 14th IEEE CPMT Symposium Japan (ICSJ2025), focusing on the "FPIM (TM) Series" (hereinafter referred to as "this material"), a negative-type photosensitive insula...
Oversubscribed financing round consisting of €77 million in Series C equity capital, led by HV Capital and DTCF, and €23 million in public funding, marking one of the largest capital rounds in the European semiconductor sector Fresh capital accelerates the commercialization of FMC DRAM+ and 3D CACHE+ memory chips to enable the global ramp-up of AI data centers and AI edge applications...
Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, announced that it has delivered the industry’s first sixth-generation Registered Clock Driver (RCD) for DDR5 Registered Dual In-line Memory Modules (RDIMMs). The new RCD is the first to achieve a data rate of 9600 Mega Transfers Per Second (MT/s), surpassing the industry standard. This brea...
New Framework outlines OIF’s vision for 448 Gbps interconnects, setting the stage for future Implementation Agreements that will power AI, HPC and communications systems OIF convened its Q4 2025 Technical and MA&E Committees Meeting in Busan, South Korea, Nov. 3–7, where global members gathered to advance the organization’s work across optical, electrical, manage...
Distributed Rendering Solution Unlocks a New Visual Experience with Low Power Consumption and High Image Quality Pixelworks, Inc. (NASDAQ: PXLW), a leading provider of visual processing solutions, announced that it offers an advanced distributed rendering solution for the R1 gaming chip equipped in the realme GT8 series smartphones. By integrating ultra-low latency MotionEngi...
Canaan Inc. (NASDAQ: CAN) ("Canaan" or the "Company"), an innovator in crypto mining, announced the closing of the registered direct offering with institutional investors that the Company announced on November 4, 2025. The offering totaled US$72 million of the Company's American depositary shares ("ADSs"), each representing 15 Class A ordinary shares, at a price of US$1.131 per ADS....
Strengthening strategic cooperation for next-generation semiconductor package core material 'Glass Core' Aiming to lead the glass substrate market by combining strengths in preparation for the AI era Samsung Electro-Mechanics announced on the 5th that it has signed a memorandum of understanding (MOU) with Sumitomo Chemical Group to establish a joint venture (JV) for man...
CELUS, the developer of a leading AI-assisted electronics design platform, and NextPCB, a globally recognized PCB manufacturing and assembly service provider, announced a strategic partnership aimed at streamlining the electronics development lifecycle from concept to mass production. Through this partnership, NextPCB users will gain access to the CELUS Design Platform for seamless idea creatio...
Tinicum, L.P. (“Tinicum”) today announced that one of its affiliates has signed an agreement to acquire the aerospace assets of TriMas Corporation (“TriMas Aerospace”), through which TriMas Aerospace will be merged with PennAero, a Tinicum portfolio company (“the Transaction”). Funds managed by Blackstone will be a minority investor in the Transaction. This in...
Magnachip Semiconductor Corporation (NYSE: MX) (“Magnachip” or the “Company”) announced it has concluded an agreement with Hyundai Mobis Company Limited (hereinafter “MOBIS”) regarding the use of high-performance Insulated Gate Bipolar Transistor (IGBT) technology, and plans to expand its business based on this technology. Hyundai Mobis is a global auto ...
The new high-capacity, high-performance storage is purpose-built for the demands of modern AI-enabled surveillance systems Toshiba Electronic Devices & Storage Corporation (Toshiba) has introduced S300 AI, a new generation of surveillance hard disk drives (HDDs) engineered for the requirements of modern artificial intelligence (AI) driven video applications. Purpose-built for high...
Global technology corporation FPT has entered a strategic partnership with LAPI ITB, a consulting and professional services provider owned by Institut Teknologi Bandung (ITB), and digital transformation consulting firm Digital Utama Lestari (DUL) to jointly accelerate Indonesia’s National Digital Transformation agenda for a competitive digital economy through joint innovation, technology d...
The semiconductor manufacturing equipment market is projected to surge to approximately US $159 billion by 2030, underscoring the Asia-Pacific region’s continued leadership in the global chip-making ecosystem. Emerging markets such as India and Vietnam, alongside established players Japan and South Korea, are witnessing robust investment in equipment capacity, technology tran...